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Inventor

Christopher James Kapusta

Inventor
Delanson, NY, US

Overview

70→
Patents
2002–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 70 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01LSemiconductor devices13%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification6%
B81BMicrostructural devices or systems, e.g. micromechanical devices5%
G01RMeasuring electric variables4%
H01PWaveguides3%
G02BOptical elements, systems or apparatus2%
H10HInorganic light-emitting semiconductor devices having potential barriers2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
11,079,359Sensor system and method202110,957,832Electronics package for light emitting semiconductor devices and method of manufacturing thereof202110,892,231Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof202110,892,237Methods of fabricating high voltage semiconductor devices having improved electric field suppression202110,804,115Electronics package with integrated interconnect structure and method of manufacturing thereof202010,804,174Non-magnetic package and method of manufacture202010,804,116Electronics package with integrated interconnect structure and method of manufacturing thereof202010,784,576True time delay beam former module and method of making the same202010,770,382Low inductance stackable solid-state switching module and method of manufacturing thereof202010,660,208Embedded dry film battery module and method of manufacturing thereof202010,605,785Sensor system and method202010,607,929Electronics package having a self-aligning interconnect assembly and method of making same202010,541,209Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof202010,541,153Electronics package with integrated interconnect structure and method of manufacturing thereof2020RE047651Stackable electronic package and method of fabricating same201910,431,509Non-magnetic package and method of manufacture201910,432,168Systems and methods for quartz wafer bonding201910,332,832Method of manufacturing an electronics package using device-last or device-almost last placement201910,333,493Embedded RF filter package structure and method of manufacturing thereof201910,208,382Method for making a seam-sealable non-magnetic lid and package201910,196,745Lid and method for sealing a non-magnetic package201910,163,773Electronics package having a self-aligning interconnect assembly and method of making same201810,014,286Stackable electronics package and method of fabricating same20189,954,263Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same20189,814,419'Pulse oximetry devices and systems and methods of making the same'20179,806,390'Radio frequency die package with inverted ground plane and method of making same'20179,666,516'Electronic packages and methods of making and using the same'20179,642,566'Flexible embedded sensor arrays and methods of making the same'20179,570,783'Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same'20179,299,661'Integrated circuit package and method of making same'20169,024,447'Stackable electronic package and method of making same'20158,940,582'Stackable electronic package and method of fabricating same'20158,748,754'System and method of forming a patterned conformal structure'20148,742,646'Ultrasound acoustic assemblies and methods of manufacture'20148,536,700'Stackable electronic package and method of fabricating same'20138,276,268'System and method of forming a patterned conformal structure'20128,163,596'Stackable electronic package and method of making same'20128,115,117'System and method of forming isolated conformal shielding areas'20128,026,608'Stackable electronic package'20117,993,064'Photonic power devices and methods of manufacturing the same'20117,952,196'Affordable high performance high frequency multichip module fabrication and apparatus'20117,952,187'System and method of forming a wafer scale package'20117,901,970'Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components'20117,752,751'System and method of forming a low profile conformal shield'20107,741,832'Micro-electromechanical system (MEMS) based current and magnetic field sensor using tunneling current sensing'20107,727,808'Ultra thin die electronic package'20107,696,676'Piezoelectric composite apparatus and related methods'20107,633,667'Apparatus and method of forming high performance integrated RF optical module'20097,605,466'Sealed wafer packaging of microelectromechanical systems'20097,570,133'Wideband passive amplitude compensated time delay module'20097,508,189'Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities'20097,495,430'MEMS based current sensor using magnetic-to-mechanical conversion and reference components'20097,466,121'MEMS based current sensor using magnetic-to-mechanical conversion and reference components'20087,427,566'Method of making an electronic device cooling system'20087,390,857'Crosslinkable and crosslinked polymers'20087,316,512'Interconnect device'20087,315,161'Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components'20087,221,144'Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities'20077,112,951'MEMS based current sensor using magnetic-to-mechanical conversion and reference components'20067,046,879'Optical via for three dimensional interconnection'20067,018,580'Method and apparatus for forming tapered waveguide structures'20066,994,897'Method of processing high-resolution flex circuits with low distortion'20066,988,706'Piezoelectric microvalve'20066,935,792'Optoelectronic package and fabrication method'20056,773,962'Microelectromechanical system device packaging method'20046,767,764'Microelectromechanical system device packaging method'20046,737,002'Fabrication of plastic module with exposed backside contact'20046,706,624'Method for making multichip module substrates by encapsulating electrical conductors'20046,602,739'Method for making multichip module substrates by encapsulating electrical conductors and filling gaps'20036,429,381'High density interconnect multichip module stack and fabrication method'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2021Patents assigned to GEN ELECTRIC (64)· patent assignee history
2002–2011Based in Duanesburg, NY, US· patent location history
2003–2011Patents assigned to LOCKHEED CORP (6)· patent assignee history
2007–2021Based in Delanson, NY, US· patent location history
2012–2018Patents assigned to KAPUSTA CHRISTOPHER JAMES (9)· patent assignee history
2012–2018Patents assigned to SABATINI JAMES (5)· patent assignee history
2012–2014Patents assigned to CUNNINGHAM DONALD PAUL (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
GEN ELECTRIC642002–2021
KAPUSTA CHRISTOPHER JAMESself92012–2018
LOCKHEED CORP62003–2011
SABATINI JAMES52012–2018
CUNNINGHAM DONALD PAUL32012–2014
Locations
LocationPatentsSpan
Delanson, New York, US522007–2021
Duanesburg, New York, US182002–2011