Inventor
Hsien-Wei Chen
Inventor
Hsinchu, TW
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
G06FElectric digital data processing5%
H04NPictorial communication, e.g. television5%
G06TImage data processing or generation, in general2%
PatentTitleYear
11,043,410Packages with through-vias having tapered ends202111,043,482Semiconductor component, package structure and manufacturing method thereof202111,043,463Interconnect structures and methods of forming same202111,037,899Package structures and methods of forming the same202111,037,887Method of making package assembly including stress relief structures202111,031,363Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices202111,031,354Mixing organic materials into hybrid packages202111,031,352Routing design of dummy metal cap and redistribution line202111,018,025Redistribution lines having stacking vias202111,018,070Semiconductor die, manufacturing method thereof, and semiconductor package202111,018,091Eliminate sawing-induced peeling through forming trenches202111,018,104Semiconductor structure and method for manufacturing the same202111,018,066Integrated circuit package and method of forming same202111,018,069Underfill control structures and method202111,018,088Dummy features in redistribution layers (RDLS) and methods of forming same20219,865,083'Apparatus and method for inpainting three-dimensional stereoscopic image'20189,147,021'Data processing method and device using the same'20158,698,797'Method and device for generating multi-views three-dimensional (3D) stereoscopic image'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2018Patents assigned to IND TECH RES INST (3)· patent assignee history
2014Patents assigned to CHEN HSIN JUNG (1)· patent assignee history
2014Patents assigned to LO FENG HSIANG (1)· patent assignee history
2014–2018Based in Yilan County, TW· patent location history
2015Patents assigned to CHEN HSIN-JUNG (1)· patent assignee history
2015Based in Jiaoxi Township, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (15)· patent assignee history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 15 | 2021 |
| IND TECH RES INST | 3 | 2014–2018 |
| CHEN HSIN JUNGself | 1 | 2014 |
| CHEN HSIN-JUNGself | 1 | 2015 |
| LO FENG HSIANG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 15 | 2021 |
| Yilan County, TW | 2 | 2014–2018 |
| Jiaoxi Township, TW | 1 | 2015 |