Inventor
SHAO HSUAN CHUANG
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
G02BOptical elements, systems or apparatus11%
H01FMagnets5%
H01GCapacitors5%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices5%
PatentTitleYear
11,886,015Recessed portion in a substrate and method of forming the same202411,848,143Electronic device and method for manufacturing the same202311,495,557Semiconductor device and method of manufacturing the same202211,410,957Semiconductor package structure and method of manufacturing the same202211,411,073Semiconductor package device and method for manufacturing the same202211,398,442Bonding structure, package structure, and method for manufacturing package structure202211,262,506Recessed portion in a substrate and method of forming the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to ADVANCED SEMICONDUCTOR ENG (7)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 7 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2022–2024 |