Inventor
CHI-MAO HSU
Inventor
TW
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10DInorganic electric semiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10BElectronic memory devices7%
H01CResistors2%
PatentTitleYear
12,438,092Semiconductor device having contact plug connected to gate structure on PMOS region202512,211,888Method for forming a thin film resistor with improved thermal stability202512,119,272Semiconductor device and method for fabricating the same202412,107,151Semiconductor device and method for fabricating the same202412,057,401Semiconductor device having contact plug connected to gate structure on PMOS region202411,877,433Storage node contact structure of a memory device202411,791,219Semiconductor device and method for fabricating the same202311,756,888Semiconductor device having contact plug connected to gate structure on PMOS region202311,749,743Semiconductor device and method for fabricating the same202311,527,448Semiconductor device and method for fabricating the same202211,508,832Semiconductor device and method for fabricating the same202211,239,241Bit line utilized in DRAM202211,239,243Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same202211,139,384Method for fabricating semiconductor device2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to UNITED MICROELECTRONICS CORP (14)· patent assignee history
2021–2025Based in TW· patent location history
2022–2024Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 14 | 2021–2025 |
| FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD | 3 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 14 | 2021–2025 |