Inventor
YOUNG KUN JEE
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices47%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,568,837Semiconductor chip, semiconductor package including the same, and method of fabricating the same202612,300,665Semiconductor package202511,935,873Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips202411,621,250Semiconductor packages202311,488,910Semiconductor package having redistribution layer202211,282,792Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads202211,227,855Semiconductor package202211,222,873Semiconductor packages including stacked substrates and penetration electrodes2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2022–2026 |