Inventor
Shinya Soneda
Inventor
JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices38%
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
C23CCoating metallic material2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems2%
H03KPulse technique2%
PatentTitleYear
12,593,462IGBT and diode with lifetime control regions202612,575,167Semiconductor device and method of manufacturing semiconductor device202612,568,638Semiconductor device and power conversion apparatus202612,538,811Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin202612,507,427Semiconductor device202512,402,337Semiconductor device and method for controlling semiconductor device202512,341,503Semiconductor device and method for controlling the same202512,342,606Semiconductor device and method of manufacturing semiconductor device202512,328,933Semiconductor device202512,328,887Semiconductor device and method of manufacturing semiconductor device202512,300,569Semiconductor device202512,243,795Semiconductor device202512,159,944RC-IGBT with lifetime control layer202412,154,976Semiconductor device and method of manufacturing semiconductor device202412,142,605Semiconductor device and method for manufacturing the same202412,068,310Semiconductor device202412,020,935Method of manufacturing semiconductor device202412,002,806Reverse conducting semiconductor device and method for manufacturing reverse conducting semiconductor device202411,875,990Semiconductor device including IGBT, boundary, and diode regions202411,799,023Semiconductor device202311,621,321Semiconductor device202311,610,882Semiconductor device and method of manufacturing semiconductor device202311,462,615Semiconductor device202211,322,604Semiconductor device and manufacturing method thereof202211,276,773Semiconductor device202211,264,245Method for manufacturing semiconductor device202211,256,171Film resist and method of manufacturing semiconductor device202211,239,329Semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to MITSUBISHI ELECTRIC CORP (28)· patent assignee history
2022–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 28 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 28 | 2022–2026 |