Inventor
Abram Castro
Inventor
Fort Worth, TX, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H01LSemiconductor devices25%
B29CShaping or joining of plastics3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
H01BCables3%
H01CResistors3%
H01GCapacitors3%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
10,804,185Integrated circuit chip with a vertical connector202010,756,013Packaged semiconductor system having unidirectional connections to discrete components202010,727,085Printed adhesion deposition to mitigate integrated circuit package delamination202010,566,276Packaged semiconductor system having unidirectional connections to discrete components202010,347,508Printed adhesion deposition to mitigate integrated circuit delamination201910,284,172Acoustic device package and method of making201910,199,348Plastic-packaged semiconductor device having wires with polymerized insulating layer20199,875,930Method of packaging a circuit20189,780,017'Packaged device with additive substrate surface modification'20179,601,414'Method for preventing die pad delamination'20179,536,781'Method of making integrated circuit'20179,524,926'Packaged device with additive substrate surface modification'20169,378,984'Packaging a semiconductor device having wires with polymerized insulator skin'20169,305,869'Packaged semiconductor device having leadframe features as pressure valves against delamination'20169,214,440'Method for preventing die pad delamination'20159,142,472'Integrated circuit and method of making'20159,129,955'Semiconductor flip-chip system having oblong connectors and reduced trace pitches'20158,530,360'Method for low stress flip-chip assembly of fine-pitch semiconductor devices'20138,133,761'Packaged system of semiconductor chips having a semiconductor interposer'20127,898,083'Method for low stress flip-chip assembly of fine-pitch semiconductor devices'20117,573,139'Packed system of semiconductor chips having a semiconductor interposer'20097,569,918'Semiconductor package-on-package system including integrated passive components'20097,390,700'Packaged system of semiconductor chips having a semiconductor interposer'20086,801,438'Electrical circuit and method of formation'20046,534,861'Ball grid substrate for lead-on-chip semiconductor package'20036,501,168'Substrate for an integrated circuit package'20026,300,165'Ball grid substrate for lead-on-chip semiconductor package'20016,248,612'Method for making a substrate for an integrated circuit package'20016,107,683'Sequentially built integrated circuit package'20005,650,593'Thermally enhanced chip carrier package'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997Patents assigned to AMKOR ELECTRONICS INC (1)· patent assignee history
1997–2020Based in Fort Worth, TX, US· patent location history
2000–2003Patents assigned to SUBSTRATE TECHNOLOGIES INC (5)· patent assignee history
2008–2020Patents assigned to TEXAS INSTRUMENTS INC (23)· patent assignee history
2012–2015Patents assigned to CASTRO ABRAM M (3)· patent assignee history
2012–2015Patents assigned to GERBER MARK A (2)· patent assignee history
2017–2020Based in Carrollton, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 23 | 2008–2020 |
| SUBSTRATE TECHNOLOGIES INC | 5 | 2000–2003 |
| CASTRO ABRAM Mself | 3 | 2012–2015 |
| GERBER MARK A | 2 | 2012–2015 |
| AMKOR ELECTRONICS INC | 1 | 1997 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fort Worth, Texas, US | 27 | 1997–2020 |
| Carrollton, Texas, US | 3 | 2017–2020 |