Inventor
Dacheng Huang
Inventor
Shanghai, CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H05KPrinted circuits14%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2018Based in Shanghai, CN· patent location history
2017Patents assigned to BAI YE (1)· patent assignee history
2017Patents assigned to CHIU CHIN-TIEN (1)· patent assignee history
2017Patents assigned to HUANG DACHENG (1)· patent assignee history
2017Patents assigned to QIAN KAIYOU (1)· patent assignee history
2017Patents assigned to SANDISK INFORMATION TECH (SHANGHAI) CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BAI YE | 1 | 2017 |
| CHIU CHIN-TIEN | 1 | 2017 |
| HUANG DACHENGself | 1 | 2017 |
| QIAN KAIYOU | 1 | 2017 |
| SANDISK INFORMATION TECH (SHANGHAI) CO LTD | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shanghai, CN | 3 | 2016–2018 |