Inventor
Ying-Chun Tseng
Inventor
Taipei, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing15%
H01LSemiconductor devices15%
H01RElectrically-conductive connections15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10TTechnical subjects covered by former us classification15%
H05KPrinted circuits8%
PatentTitleYear
11,011,501Package structure, package-on-package structure and method of fabricating the same202111,004,786Package structure and method of forming the same20218,533,511'Notebook computer'2013RE041878'Computer system with PCI express interface'20107,444,452'Computer system with a PCI express interface'20087,248,470'Computer system with PCI express interface'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2008Patents assigned to ASROCK INC (2)· patent assignee history
2007–2013Based in Taipei, TW· patent location history
2010Patents assigned to ASUSTEK COMP INC (1)· patent assignee history
2013Patents assigned to GIGA BYTE TECH CO LTD (1)· patent assignee history
2013Patents assigned to HWANG RAIN-TED (1)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Tainan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASROCK INC | 2 | 2007–2008 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2021 |
| ASUSTEK COMP INC | 1 | 2010 |
| GIGA BYTE TECH CO LTD | 1 | 2013 |
| HWANG RAIN-TED | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taipei, TW | 4 | 2007–2013 |
| Tainan, TW | 2 | 2021 |