Inventor
Bong-Sub Lee
Inventor
Mountain View, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification16%
G11CStatic stores5%
H10BElectronic memory devices5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
PatentTitleYear
10,985,180Semiconductor device and manufacturing method thereof202110,440,822Interposers with electrically conductive features having different porosities201910,381,326Structure and method for integrated circuits packaging with increased density20199,769,923'Interposers'20179,570,385'Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2019Patents assigned to INVENSAS CORP (4)· patent assignee history
2017–2019Based in Mountain View, CA, US· patent location history
2021Patents assigned to SK HYNIX INC (1)· patent assignee history
2021Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INVENSAS CORP | 4 | 2017–2019 |
| SK HYNIX INC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mountain View, California, US | 4 | 2017–2019 |
| Seoul, KR | 1 | 2021 |