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Inventor

Norio Fukasawa

Inventor
Kawasaki, JP

Overview

32→
Patents
1998–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H10DInorganic electric semiconductor devices11%
G11BInformation storage based on relative movement between record carrier and transducer10%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
G01RMeasuring electric variables5%
B29CShaping or joining of plastics4%
H05KPrinted circuits3%
B23KSoldering or unsoldering1%
B30BPresses in general1%
PatentTitleYear
11,050,091Solid battery, manufacturing method of solid battery, battery pack, vehicle, power storage system, power tool, and electronic equipment20218,980,692'Semiconductor device manufacturing method'20158,664,775'Semiconductor device'20148,357,620'Laser annealing method and laser annealing apparatus'20137,872,360'Semiconductor device and method of manufacturing the same'20117,616,548'Optical pickup apparatus and optical disc apparatus'20097,586,185'Semiconductor device having a functional surface'20097,556,985'Method of fabricating semiconductor device'20097,345,982'Optical pickup device, optical disk drive, optical device and composite optical element'20087,248,544'Optical head and recording and/or reproducing apparatus employing same'20077,180,668'Optical pickup device and optical disc device'20077,064,047'Semiconductor device having a ball grid array and a fabrication process thereof'20067,064,900'Optical pickup device and optical disk device and optical device and composite optical element'20066,987,614'Optical pickup and optical disc drive device'20066,987,054'Method of fabricating a semiconductor device having a groove formed in a resin layer'20066,881,611'Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device'20056,784,542'Semiconductor device having a ball grid array and a fabrication process thereof'20046,657,282'Semiconductor device having a ball grid array and a fabrication process thereof'20036,518,784'Test method using semiconductor test apparatus'20036,515,347'Wafer level semiconductor device and method of manufacturing the same'20036,511,620'Method of producing semiconductor devices having easy separability from a metal mold after molding'20036,507,092'Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same'20036,471,501'Mold for fabricating semiconductor devices'20026,469,370'Semiconductor device and method of production of the semiconductor device'20026,455,920'Semiconductor device having a ball grid array and a fabrication process thereof'20026,437,432'Semiconductor device having improved electrical characteristics and method of producing the same'20026,388,461'Semiconductor inspection apparatus and inspection method using the apparatus'20026,333,638'Semiconductor test apparatus and test method using the same'20016,246,249'Semiconductor inspection apparatus and inspection method using the apparatus'20016,188,528'Optical lens, and optical pickup and optical disc apparatus using such lens'20016,013,944'Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board'20005,767,528'Semiconductor device including pad portion for testing'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2006Patents assigned to FUJITSU LTD (18)· patent assignee history
1998–2009Based in Kawasaki, JP· patent location history
2001–2013Patents assigned to SONY CORP (8)· patent assignee history
2001–2013Based in Kanagawa, JP· patent location history
2009Patents assigned to FUJITSU MICROELECTRONICS LTD (2)· patent assignee history
2011–2015Patents assigned to FUJITSU SEMICONDUCTOR LTD (3)· patent assignee history
2011Based in Aizuwakamatsu, JP· patent location history
2013–2014Patents assigned to FUKASAWA NORIO (2)· patent assignee history
2014–2015Based in Sendai, JP· patent location history
2021Based in Nagaokakyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD181998–2006
SONY CORP82001–2013
FUJITSU SEMICONDUCTOR LTD32011–2015
FUJITSU MICROELECTRONICS LTD22009
FUKASAWA NORIOself22013–2014
Locations
LocationPatentsSpan
Kawasaki, JP201998–2009
Kanagawa, JP82001–2013
Sendai, JP22014–2015
Nagaokakyo, JP12021
Aizuwakamatsu, JP12011