Inventor
Takaaki Miyamoto
Inventor
Kanagawa, JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B41Jprimary
B41JTypewriters31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
C23CCoating metallic material11%
Y10TTechnical subjects covered by former us classification9%
H10DInorganic electric semiconductor devices6%
C30BSingle-crystal growth2%
H01JElectric discharge tubes or discharge lamps2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
7,836,598'Method of manufacturing a thermal liquid jet head using an etching process'20107,690,768'Liquid ejecting head and liquid ejecting apparatus'20107,537,311'Method and apparatus for ejecting liquid'20097,470,004'Liquid ejection head and liquid ejection device'20087,431,430'Liquid ejecting head having selectively controlled heat-energy evolving element regions'20087,410,247'Liquid ejection head and liquid ejection apparatus'20087,334,878'Liquid ejection head and liquid ejection apparatus'20087,261,393'Liquid jetting head, liquid jetting apparatus, and method of manufacturing the liquid jetting head'20077,182,440'Liquid jet apparatus'20077,066,571'Liquid ejection apparatus'20067,028,402'Method of manufacturing a liquid dispenser'20066,848,770'Liquid dispenser and printer'20056,773,091'Liquid discharge device and method of manufacturing the same'20046,685,304'Printer, printer head and method of producing the print head to promote reliable bonding of print head structures'20046,624,062'Wiring structure in semiconductor device and method for forming the same'20036,592,209'Printer, printer head, and method of producing the printer head'20036,536,877'Printer, printer head, and method for fabricating printer head formed with a multilayer wiring pattern'20036,513,912'Heat generating element for printer head and manufacturing method therefor'20036,380,065'Interconnection structure and fabrication process therefor'20026,337,515'Wiring structure in semiconductor device and method for forming the same'20026,331,485'Method of producing semiconductor device'20016,284,649'Chemical vapor phase growing method of a metal nitride film and a method of manufacturing an electronic device using the same'20016,143,377'Process of forming a refractory metal thin film'20006,114,764'Semiconductor device and process for fabricating the same'20006,040,021'Plasma CVD process for metal films and metal nitride films'20005,981,388'Plasma CVD method for forming a semiconductor device having metal film formed thereby'19995,962,084'Plasma CVD process and semiconductor device having metal film formed by the process'19995,840,628'Plasma CVD method for depositing tin layer'19985,831,335'Semiconductor device contains refractory metal or metal silicide with less than 1% weight of halogen atom'19985,747,384'Process of forming a refractory metal thin film'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2010Patents assigned to SONY CORP (30)· patent assignee history
1998–2010Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 30 | 1998–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 30 | 1998–2010 |