Inventor
Futoshi Ishikawa
Inventor
Nagoya, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material62%
H05KPrinted circuits15%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry8%
B05DProcesses for applying fluent materials to surfaces, in general8%
B82YSpecific uses or applications of nanostructures8%
PatentTitleYear
5,965,211'Electroless copper plating solution and process for formation of copper film'19995,405,656'Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor'19955,039,338'Electroless copper plating solution and process for formation of copper film'19914,956,014'Electroless copper plating solution'19904,935,267'Process for electrolessly plating copper and plating solution therefor'19904,834,796'Electroless copper plating solution and process for electrolessly plating copper'19894,814,009'Electroless copper plating solution'19894,790,876'Chemical copper-blating bath'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1999Patents assigned to NIPPON DENSO CO (8)· patent assignee history
1988–1999Based in Nagoya, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIPPON DENSO CO | 8 | 1988–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagoya, JP | 8 | 1988–1999 |