Inventor
Masayoshi Natsume
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification31%
C09JAdhesives23%
B29CShaping or joining of plastics8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
B44CProducing decorative effects8%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for8%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables8%
C08LCompositions of macromolecular compounds8%
PatentTitleYear
9,162,632'Patterned pressure-sensitive adhesive body and producing method thereof'20157,556,762'Method of inflation extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet'20097,299,845'Method and apparatus for joining adhesive tape'20076,773,806'Adhesive tape and substrate for adhesive tape'20046,586,090'Adhesive tape and substrate for adhesive tape'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2015Patents assigned to NITTO DENKO CORP (5)· patent assignee history
2003–2004Based in Ibaraki, JP· patent location history
2007–2015Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 5 | 2003–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 3 | 2007–2015 |
| Ibaraki, JP | 2 | 2003–2004 |