Inventor
Yang TI
Inventor
CN
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Bprimary
H01BCables19%
C09JAdhesives13%
H05KPrinted circuits13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
Y10TTechnical subjects covered by former us classification13%
B22FWorking metallic powder6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
C08LCompositions of macromolecular compounds6%
H01LSemiconductor devices6%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to HENKEL AG & CO KGAA (3)· patent assignee history
2024–2026Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HENKEL AG & CO KGAA | 3 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 3 | 2024–2026 |