Inventor
Muhammad M. Rasheed
Inventor
San Jose, CA, US
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material29%
H01JElectric discharge tubes or discharge lamps24%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
H01LSemiconductor devices6%
Y10TTechnical subjects covered by former us classification6%
H10DInorganic electric semiconductor devices3%
C04BLime, magnesia2%
C30BSingle-crystal growth1%
H02NElectric machines not otherwise provided for1%
H05HPlasma technique1%
PatentTitleYear
11,011,676PVD buffer layers for LED fabrication202110,763,090High pressure RF-DC sputtering and methods to improve film uniformity and step-coverage of this process202010,718,049Process kit shield for improved particle reduction202010,704,147Process kit design for in-chamber heater and wafer rotating mechanism202010,704,142Quick disconnect resistance temperature detector assembly for rotating pedestal202010,692,706Methods and apparatus for reducing sputtering of a grounded shield in a process chamber202010,571,069Gimbal assembly for heater pedestal202010,519,546Apparatus and method for providing a uniform flow of gas201910,407,771Atomic layer deposition chamber with thermal lid201910,214,815Surface treated aluminum nitride baffle201910,199,204Target retaining apparatus201910,167,553Apparatus and method for providing a uniform flow of gas201910,096,455Extended dark space shield201810,060,024Sputtering target for PVD chamber20189,957,601Apparatus for gas injection in a physical vapor deposition chamber20189,960,021Physical vapor deposition (PVD) target having low friction pads20189,914,632'Methods and apparatus for liquid chemical delivery'20189,914,999'Oxidized showerhead and process kit parts and methods of using same'20189,834,840Process kit shield for improved particle reduction20179,752,228'Sputtering target for PVD chamber'20179,689,070'Deposition ring and electrostatic chuck for physical vapor deposition chamber'20179,633,824'Target for PVD sputtering system'20179,534,286'PVD target for self-centering process shield'20179,472,443'Selectively groundable cover ring for substrate process chambers'20169,396,933'PVD buffer layers for LED fabrication'20169,343,274'Process kit shield for plasma enhanced processing chamber'20169,303,311'Substrate processing system with mechanically floating target assembly'20169,281,167'Variable radius dual magnetron'20169,255,322'Substrate processing system having symmetric RF distribution and return paths'20169,222,172'Surface treated aluminum nitride baffle'20159,202,736'Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing'20159,177,763'Method and apparatus for measuring pressure in a physical vapor deposition chamber'20159,087,679'Uniformity tuning capable ESC grounding kit for RF PVD chamber'20158,968,537'PVD sputtering target with a protected backing plate'20158,911,601'Deposition ring and electrostatic chuck for physical vapor deposition chamber'20148,895,450'Low resistivity tungsten PVD with enhanced ionization and RF power coupling'20148,795,488'Apparatus for physical vapor deposition having centrally fed RF energy'20148,702,918'Apparatus for enabling concentricity of plasma dark space'20148,647,485'Process kit shield for plasma enhanced processing chamber'20148,580,094'Magnetron design for RF/DC physical vapor deposition'20138,558,299'Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming'20138,409,355'Low profile process kit'20138,252,410'Ceramic cover wafers of aluminum nitride or beryllium oxide'20128,108,981'Method of making an electrostatic chuck with reduced plasma penetration and arcing'20128,022,377'Method and apparatus for excimer curing'20117,964,040'Multi-port pumping system for substrate processing chambers'20117,848,076'Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing'20107,811,411'Thermal management of inductively coupled plasma reactors'20107,789,993'Internal balanced coil for inductively coupled high density plasma processing chamber'20107,722,737'Gas distribution system for improved transient phase deposition'20107,572,647'Internal balanced coil for inductively coupled high density plasma processing chamber'20097,498,268'Gas delivery system for semiconductor processing'20097,183,227'Use of enhanced turbomolecular pump for gapfill deposition using high flows of low-mass fluent gas'20077,141,138'Gas delivery system for semiconductor processing'20066,764,265'Erosion resistant slit valve'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2021Patents assigned to APPLIED MATERIALS INC (55)· patent assignee history
2004–2019Based in Fremont, CA, US· patent location history
2012–2017Patents assigned to RASHEED MUHAMMAD (11)· patent assignee history
2012–2017Patents assigned to RASHEED MUHAMMAD M (7)· patent assignee history
2012–2021Based in San Jose, CA, US· patent location history
2013–2017Patents assigned to WANG RONGJUN (7)· patent assignee history
2013–2016Patents assigned to MILLER KEITH A (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 55 | 2004–2021 |
| RASHEED MUHAMMADself | 11 | 2012–2017 |
| RASHEED MUHAMMAD Mself | 7 | 2012–2017 |
| WANG RONGJUN | 7 | 2013–2017 |
| MILLER KEITH A | 5 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 39 | 2012–2021 |
| Fremont, California, US | 16 | 2004–2019 |