Inventor
FUMITOMO WATANABE
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
PatentTitleYear
12,119,325Semiconductor device assemblies with molded support substrates202411,742,252Shielded fan-out packaged semiconductor device and method of manufacturing202311,335,667Stacked semiconductor die assemblies with die substrate extensions202211,158,554Shielded fan-out packaged semiconductor device and method of manufacturing2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2021–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 4 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2021–2024 |