Inventor
Mark J. LaPlante
Inventor
Walden, NY, US
Overview
Patents· 57 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification21%
B23KSoldering or unsoldering8%
B26FPerforating8%
B26DCutting5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
B05CApparatus for applying fluent materials to surfaces, in general3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
8,337,646'Greensheet via repair/fill tool'20128,297,222'Fully automated paste dispense system for dispensing small dots and lines'20128,156,990'Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers'20127,984,546'Tool for filling vias in a greensheet'20117,964,237'Fully automated paste dispense process for dispensing small dots and lines'20117,947,143'Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers'20117,894,919'Fully automated paste dispense system for dispensing small dots and lines'20117,887,874'Fully automated paste dispense system for dispensing small dots and lines'20117,836,935'Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers'20107,510,619'Greensheet via repair/fill tool'20097,294,909'Electronic package repair process'20076,916,670'Electronic package repair process'20056,823,585'Method of selective plating on a substrate'20046,679,146'Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool'20046,615,481'Method for fabrication of electromagnetic coil vanes'20036,565,496'Fully automated precision punch head loader for universal gang-punch tool'20036,532,654'Method of forming an electrical connector'20036,405,622'Support apparatus for positioning a workpiece'20026,389,940'Gang punch tool assembly'20026,314,852'Gang punch tool assembly'20016,276,246'Method for punching slug from workpiece'20016,272,957'Flex die punching apparatus and method'20016,262,390'Repair process for aluminum nitride substrates'20016,223,636'Low-cost high-density gang punch'20016,207,330'Formation of punch inspection masks and other devices using a laser'20016,133,540'Apparatus and method for producing punch pin with spherical head'20006,127,069'Method of visually inspecting positioning of a pattern on a substrate'20006,116,127'Flex die punching apparatus and method'20006,055,894'Support apparatus for positioning a workpiece'20006,017,025'Component retainer'20006,003,418'Punched slug removal system'19995,996,985'Component retainer'19995,974,931'Flex die punching apparatus and method'19995,958,628'Formation of punch inspection masks and other devices using a laser'19995,929,865'Method of sorting two-dimensional graphic images for converting into raster lines'19995,905,352'Magneto-repulsion punching with dynamic damping'19995,891,543'Apparatus and method for screening using electrostatic adhesion'19995,874,369'Method for forming vias in a dielectric film'19995,846,361'Lamination process for producing non-planar substrates'19985,808,268'Method for marking substrates'19985,795,217'Stressed burnisher'19985,759,669'Apparatus and method for screening green sheet with via hole using porous backing material'19985,757,842'Method and apparatus for compensating thermal lensing effects in a laser cavity'19985,751,588'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing vaporization detection'19985,726,568'Magneto-repulsion punching with dynamic damping'19985,645,673'Lamination process for producing non-planar substrates'19975,635,000'Method for screening using electrostatic adhesion'19975,626,778'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing spectrometer verification'19975,620,618'Multi-wavelength programmable laser processing mechanisms and apparatus'19975,618,454'Multi-wavelength programmable laser processing mechanisms and apparatus utilizing design data translation system'19975,541,731'Interferometric measurement and alignment technique for laser scanners'19965,509,556'Process for forming apertures in a metallic sheet'19965,441,836'Laser ablation mask repair method'19955,410,233'Magneto-repulsion punching with dynamic damping'19955,404,247'Telecentric and achromatic f-theta scan lens system and method of use'19955,233,624'Method and apparatus for an increased output for a pumped laser using a moving aperture'19935,168,454'Formation of high quality patterns for substrates and apparatus therefor'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2012Patents assigned to IBM (56)· patent assignee history
1992–2002Based in Walden, NY, US· patent location history
2003–2012Based in Montgomery, NY, US· patent location history
2012Patents assigned to LAPLANTE MARK J (3)· patent assignee history
2012Patents assigned to WEISS THOMAS (2)· patent assignee history
2012Patents assigned to BUNT JAY A (1)· patent assignee history
2012Patents assigned to DIANGELO DONALD W (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 56 | 1992–2012 |
| LAPLANTE MARK Jself | 3 | 2012 |
| WEISS THOMAS | 2 | 2012 |
| BUNT JAY A | 1 | 2012 |
| DIANGELO DONALD W | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Walden, New York, US | 40 | 1992–2002 |
| Montgomery, New York, US | 17 | 2003–2012 |