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Inventor

Hock Siang Chua

Inventor
Johor, MY

Overview

2→
Patents
2016–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
B81BMicrostructural devices or systems, e.g. micromechanical devices14%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems14%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers14%
PatentTitleYear
10,770,399Semiconductor package having a filled conductive cavity20209,475,691'Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016–2020Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2016–2020Based in Johor, MY· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG22016–2020
Locations
LocationPatentsSpan
Johor, MY22016–2020