Inventor
Jui-Yu Chuang
Inventor
Taichung, TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
LOC1417%
H05KPrinted circuits8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
PatentTitleYear
7,339,280'Semiconductor package with lead frame as chip carrier and method for fabricating the same'2008D0529031'IC card type circuit module'20066,858,931'Heat sink with collapse structure for semiconductor package'20056,847,104'Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same'20056,781,222'Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof'2004D0492314'IC card type circuit module'20046,673,690'Method of mounting a passive component over an integrated circuit package substrate'20046,538,321'Heat sink with collapse structure and semiconductor package with heat sink'20036,483,178'Semiconductor device package structure'20026,472,743'Semiconductor package with heat dissipating structure'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2008Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (10)· patent assignee history
2002–2008Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 10 | 2002–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 10 | 2002–2008 |