Inventor
Alexandros Margomenos
Inventor
Pasadena, CA, US
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01LSemiconductor devices13%
H01QAntennas, i.e. radio aerials12%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
G01SRadio direction-finding5%
H01PWaveguides5%
H10DInorganic electric semiconductor devices5%
H04BTransmission5%
H03FAmplifiers3%
PatentTitleYear
11,121,731Digital radio head control202110,972,075Active quadrature circuits for high frequency applications202110,476,546Transmitter/receiver module for millimeter wave 5G MIMO communication systems201910,217,648Fabrication of microfluidic channels in diamond201910,135,483Transmitter/receiver module for millimeter wave 5G MIMO communication systems201810,079,160Surface mount package for semiconductor devices with embedded heat spreaders20189,929,243'Stepped field plate wide bandgap field-effect transistor and method'20189,866,259'Transmitter/receiver module for millimeter wave 5G MIMO communication systems'20189,837,372Wafer-level die to package and die to die interconnects suspended over integrated heat sinks20179,780,014'Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices'20179,584,073'Internally matched active single-to-differential RF converter'20179,553,057'E-plane probe with stepped surface profile for high-frequency'20179,508,652'Direct IC-to-package wafer level packaging with integrated thermal heat spreaders'20169,496,197'Near junction cooling for GaN devices'20169,385,083'Wafer-level die to package and die to die interconnects suspended over integrated heat sinks'20169,379,680'Systems, methods, and apparatus for a power amplifier module'20169,337,124'Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers'20169,331,735'GaN based active cancellation circuit for high power simultaneous transmit and receive systems'20169,276,529'High performance GaN operational amplifier with wide bandwidth and high dynamic range'20169,214,404'Apparatus for mounting microelectronic chips'20159,142,626'Stepped field plate wide bandgap field-effect transistor and method'20159,093,394'Method and structure for encapsulation and interconnection of transistors'20159,059,140'Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices'20158,786,496'Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications'20148,617,927'Method of mounting electronic chips'20138,592,983'Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device'20138,378,759'First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between'20138,305,259'Dual-band antenna array and RF front-end for mm-wave imager and radar'20128,305,255'Dual-band antenna array and RF front-end for MM-wave imager and radar'20128,138,019'Integrated (multilayer) circuits and process of producing the same'20128,089,327'Waveguide to plural microstrip transition'20128,022,861'Dual-band antenna array and RF front-end for mm-wave imager and radar'20118,013,784'Butler matrix for 3D integrated RF front-ends'20117,990,237'System and method for improving performance of coplanar waveguide bends at mm-wave frequencies'20117,986,076'Energy harvesting device'20117,928,919'Microwave antenna and method for making same'20117,855,691'Automotive radar using a metamaterial lens'20107,830,301'Dual-band antenna array and RF front-end for automotive radars'20107,824,997'Membrane suspended MEMS structures'20107,817,097'Microwave antenna and method for making same'20107,797,817'Microwave component and method for making the same'20107,760,142'Vertically integrated transceiver array'20107,733,265'Three dimensional integrated automotive radars and methods of manufacturing the same'20106,696,645'On-wafer packaging for RF-MEMS'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2012Based in Ann Arbor, MI, US· patent location history
2010–2014Patents assigned to TOYOTA ENG & MFG NORTH AMERICA (15)· patent assignee history
2011–2021Based in Pasadena, CA, US· patent location history
2012–2014Patents assigned to MARGOMENOS ALEXANDROS (6)· patent assignee history
2013–2019Patents assigned to HRL LAB LLC (17)· patent assignee history
2013–2016Patents assigned to MARGOMENOS ALEXANDROS D (3)· patent assignee history
2016–2021Based in San Jose, CA, US· patent location history
2018–2019Patents assigned to INFINEON TECHNOLOGIES AG (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HRL LAB LLC | 17 | 2013–2019 |
| TOYOTA ENG & MFG NORTH AMERICA | 15 | 2010–2014 |
| MARGOMENOS ALEXANDROSself | 6 | 2012–2014 |
| INFINEON TECHNOLOGIES AG | 3 | 2018–2019 |
| MARGOMENOS ALEXANDROS Dself | 3 | 2013–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Pasadena, California, US | 21 | 2011–2021 |
| Ann Arbor, MI, US | 14 | 2004–2012 |
| San Jose, California, US | 9 | 2016–2021 |