Inventor
Lin Fu
Inventor
Naperville, IL, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions12%
C09KMaterials for miscellaneous applications, not provided for elsewhere11%
C08LCompositions of macromolecular compounds10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients9%
H01BCables9%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry7%
B24BMachines, devices, or processes for grinding or polishing7%
H01LSemiconductor devices7%
C23FNon-mechanical removal of metallic material from surface6%
PatentTitleYear
10,562,149Polyurethane CMP pads having a high modulus ratio202010,475,555Metallized optical fiber201910,077,355Plasticizer compositions and methods for making plasticizer compositions201810,032,539Elastomer-based polymeric compositions having amorphous silica fillers20189,928,944'Cable with polymer composite core'20189,771,496'Tungsten-processing slurry with cationic surfactant and cyclodextrin'20179,672,954'Flame retardant thermoplastic composition of polycarbonate and polypropylene'20179,631,122'Tungsten-processing slurry with cationic surfactant'20179,631,110'Elastomer-based polymeric compositions having amorphous silica fillers'20179,566,686'Composition for tungsten CMP'20179,567,491'Tungsten chemical-mechanical polishing composition'20179,556,363'Copper barrier chemical-mechanical polishing composition'20179,530,537'Halogen-free propylene-based insulation and conductor coated with same'20169,518,137'Ethylene propylene-diene interpolymer composition'20169,403,965'Plasticizer for low temperature unwind with weight retention during heat aging'20169,321,912'Halogen-free flame retardant thermoplastic compositions for wire and cable applications'20169,309,442'Composition for tungsten buffing'20169,303,189'Composition for tungsten CMP'20169,303,188'Composition for tungsten CMP'20169,238,754'Composition for tungsten CMP'20168,961,807'CMP compositions with low solids content and methods related thereto'20158,920,667'Chemical-mechanical polishing composition containing zirconia and metal oxidizer'20145,385,485'Copper sleeve for lamp sockets'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995Based in Taipei, TW· patent location history
2014–2020Patents assigned to CABOT MICROELECTRONICS CORP (12)· patent assignee history
2014–2020Based in Naperville, IL, US· patent location history
2016–2019Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (10)· patent assignee history
2016–2017Patents assigned to FU LIN (4)· patent assignee history
2016–2017Patents assigned to LAUFER CAROLINE H (3)· patent assignee history
2016–2017Patents assigned to BISHOP MATTHEW T (2)· patent assignee history
2016Based in Hillsborough, NJ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CABOT MICROELECTRONICS CORP | 12 | 2014–2020 |
| DOW GLOBAL TECHNOLOGIES LLC | 10 | 2016–2019 |
| FU LINself | 4 | 2016–2017 |
| LAUFER CAROLINE H | 3 | 2016–2017 |
| BISHOP MATTHEW T | 2 | 2016–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Naperville, Illinois, US | 21 | 2014–2020 |
| Hillsborough, New Jersey, US | 1 | 2016 |
| Taipei, TW | 1 | 1995 |