Inventor
Ravi V. Mahajan
Inventor
Tempe, AZ, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification12%
H01LSemiconductor devices10%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact5%
G06FElectric digital data processing3%
H10DInorganic electric semiconductor devices3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application2%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
10,796,988Localized high density substrate routing20209,941,246Electronic assembly that includes stacked electronic devices20189,941,245Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate20189,820,384'Flexible electronic assembly method'20179,269,701'Localized high density substrate routing'20169,136,236'Localized high density substrate routing'2015RE044629'Process for assembling an integrated circuit package having a substrate vent hole'20138,441,809'Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same'20138,064,224'Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same'20117,882,624'Method of forming electronic package having fluid-conducting channel'20117,851,905'Microelectronic package and method of cooling an interconnect feature in same'20107,764,499'Electromagnetically-actuated micropump for liquid metal alloy'20107,576,432'Using external radiators with electroosmotic pumps for cooling integrated circuits'20097,539,016'Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls'20097,508,671'Computer system having controlled cooling'20097,279,796'Microelectronic die having a thermoelectric module'20077,126,822'Electronic packages, assemblies, and systems with fluid cooling'20066,992,381'Using external radiators with electroosmotic pumps for cooling integrated circuits'20066,934,154'Micro-channel heat exchangers and spreaders'20056,908,845'Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme'20056,903,929'Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink'20056,706,562'Electronic assembly with high capacity thermal spreader and methods of manufacture'20046,700,209'Partial underfill for flip-chip electronic packages'20046,490,166'Integrated circuit package having a substrate vent hole'20026,365,441'Partial underfill for flip-chip electronic packages'20026,239,973'EMI containment for microprocessor core mounted on a card using surface mounted clips'20016,191,475'Substrate for reducing electromagnetic interference and enclosure'20016,173,489'Organic substrate (PCB) slip plane \"stress deflector\" for flip chip devices'20016,043,983'EMI containment for microprocessor core mounted on a card using surface mounted clips'20006,011,696'Cartridge and an enclosure for a semiconductor package'20005,936,304'C4 package die backside coating'19995,804,771'Organic substrate (PCB) slip plane \"stress deflector\" for flip chip deivces'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2020Patents assigned to INTEL CORP (32)· patent assignee history
1998–2015Based in Tempe, AZ, US· patent location history
2002Based in Tempte, AZ, US· patent location history
2009Based in Phoenix, AZ, US· patent location history
2011–2018Patents assigned to MAHAJAN RAVI (3)· patent assignee history
2011–2013Patents assigned to SANE SANDEEP (2)· patent assignee history
2011–2020Based in Chandler, AZ, US· patent location history
2013–2015Patents assigned to MAHAJAN RAVI V (2)· patent assignee history
2015Patents assigned to CHIU CHIA-PIN (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 32 | 1998–2020 |
| MAHAJAN RAVIself | 3 | 2011–2018 |
| MAHAJAN RAVI Vself | 2 | 2013–2015 |
| SANE SANDEEP | 2 | 2011–2013 |
| CHIU CHIA-PIN | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tempe, AZ, US | 23 | 1998–2015 |
| Chandler, AZ, US | 7 | 2011–2020 |
| Phoenix, AZ, US | 1 | 2009 |
| Tempte, AZ, US | 1 | 2002 |