Inventor
Jeffrey D. Gelorme
Inventor
Plainville, CT, US
Overview
Patents· 107 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
H01LSemiconductor devices8%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
H05KPrinted circuits8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H01BCables5%
Y10TTechnical subjects covered by former us classification5%
C08LCompositions of macromolecular compounds4%
PatentTitleYear
11,121,005Handler bonding and debonding for semiconductor dies202111,094,407Electronics miniaturization platform for medication verification and tracking202110,998,217Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding202110,750,615Method and apparatus for strain relieving surface mount attached connectors202010,679,887Handler bonding and debonding for semiconductor dies202010,658,182Chip handling and electronic component integration202010,651,036Chip handling and electronic component integration202010,651,134Wafer level integration including design/co-design, structure process, equipment stress management and thermal management202010,607,963Chip package for two-phase cooling and assembly process thereof202010,586,726Handler bonding and debonding for semiconductor dies202010,573,538Handler bonding and debonding for semiconductor dies202010,522,406IR assisted fan-out wafer level packaging using silicon handler201910,522,383Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding201910,483,215Wafer level integration including design/co-design, structure process, equipment stress management and thermal management201910,395,929Chip handling and electronic component integration201910,368,441Method and apparatus for strain relieving surface mount attached connectors201910,325,785Handler bonding and debonding for semiconductor dies201910,224,219Handler bonding and debonding for semiconductor dies201910,217,637Chip handling and electronic component integration201910,174,229Adhesive resins for wafer bonding201910,168,436Water soluble low alpha particle emission electrically-conductive coating201910,079,375Dual seal microbattery and method of making20189,974,179Method and apparatus for strain relieving surface mount attached connectors20189,947,570Handler bonding and debonding for semiconductor dies20189,947,567Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding20189,935,009IR assisted fan-out wafer level packaging using silicon handler20189,850,406Adhesive resins for wafer bonding20179,748,131'Low temperature adhesive resins for wafer bonding'20179,627,784'Method and apparatus for strain relieving surface mount attached connectors'20179,601,364'Low temperature adhesive resins for wafer bonding'20179,324,601'Low temperature adhesive resins for wafer bonding'20169,275,879'Multi-chip module with rework capability'20169,263,363'Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive'20168,604,623'Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive'20138,293,141'Electronic device comprising electrically stable copper filled electrically conductive adhesive'20128,268,282'Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive'20127,981,849'Reversible thermal thickening grease'20117,964,542'Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly'20117,768,121'Apparatus and methods for cooling semiconductor integrated circuit package structures'20107,763,188'Electrically stable copper filled electrically conductive adhesive'20107,708,909'Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive'20107,567,090'Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application'20097,467,742'Electrically conducting adhesives for via fill applications'20087,452,568'Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation'20087,351,360'Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive'20087,288,839'Apparatus and methods for cooling semiconductor integrated circuit package structures'20077,219,713'Heterogeneous thermal interface for cooling'20077,166,241'Water-soluble electrically conducting polymers, their synthesis and use'20077,063,127'Method and apparatus for chip-cooling'20067,037,638'High sensitivity crosslinkable photoresist composition, based on soluble, film forming dendrimeric calix[4] arene compositions method and for use thereof'20067,026,643'Organic n-channel semiconductor device of N,N\' 3,4,9,10 perylene tetracarboxylic diimide'20067,021,124'Method and apparatus for detecting leaks in a fluid cooling system'20066,830,708'Water-soluble electrically conducting polymers, their synthesis and use'20046,746,770'Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof'20046,555,762'Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition'20036,383,415'Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof'20026,339,116'Methods of fabricating cross-linked biobased materials and structures fabricated therewith'20026,319,650'High resolution crosslinkable photoresist composition, compatable with high base concentration aqueous developers method and for use thereof'20016,238,599'High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications'20016,193,909'Cross-linked electrically conductive polymers, precursors thereof'20016,103,145'Crosslinked water-soluble electrically conducting polymers'20006,030,550'Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof'20006,017,682'Solid state extension method'20006,013,414'Photosensitive polyimide-precursor formulation'20006,010,832'Photosensitive polyimide-precursor formulation'20006,010,645'Water-soluble electrically conducting polymers, their synthesis and use'20005,919,596'Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making'19995,879,859'Strippable photoimageable compositions'19995,858,943'Gel for localized removal of reworkable encapsulant'19995,859,655'Photoresist for use in ink jet printers and other micro-machining applications'19995,833,883'Cross-linked biobased materials and uses thereof'19985,780,199'Polyamic acid and polyimide from fluorinated reactant'19985,759,637'Water-Soluable electrically conducting polymers, their synthesis and use'19985,721,299'Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof'19985,645,764'Electrically conductive pressure sensitive adhesives'19975,605,781'Photosensitive composition with cyanate esters and use thereof'19975,560,934'Cleavable diepoxide for removable epoxy compositions'19965,554,717'Synthesis of polyanilines and its co-polymers by melt condensation'19965,512,613'Cleavable diepoxide for removable epoxy compositions'19965,464,927'Polyamic acid and polyimide from fluorinated reactant'19955,464,726'Photosensitive composition and use thereof'19955,457,005'Dry developable photoresist and use thereof'19955,439,779'Aqueous soldermask'19955,391,464'Thioxanthone sensitizer for radiation sensitive polyimides'19955,382,637'Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases'19955,370,825'Water-soluble electrically conducting polymers, their synthesis and use'19945,340,914'Microwave processing'19945,317,081'Microwave processing'19945,304,457'Composition for photo imaging'19945,286,599'Base developable negative photoresist composition and use thereof'19945,278,010'Composition for photo imaging'19945,241,040'Microwave processing'19935,229,251'Dry developable photoresist containing an epoxide, organosilicon and onium salt'19935,191,182'Tuneable apparatus for microwave processing'19935,115,095'Epoxy functional organosilicon polymer'19925,110,711'Method for forming a pattern'19925,102,772'Photocurable epoxy composition with sulfonium salt photoinitiator'19925,098,766'Encapsulated wire circuit board'19925,098,816'Method for forming a pattern of a photoresist'19925,059,512'Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions'19915,054,872'Polymeric optical waveguides and methods of forming the same'19915,047,568'Sulfonium salts and use and preparation thereof'19915,041,470'Flame retardant photocurable adhesive for wires and circuit boards'19915,026,624'Composition for photo imaging'19914,940,651'Method for patterning cationic curable photoresist'19904,882,245'Photoresist composition and printed circuit boards and packages made therewith'19894,615,763'Roughening surface of a substrate'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2021Patents assigned to IBM (107)· patent assignee history
1986–1997Based in Binghamton, NY, US· patent location history
1990–2008Based in Plainville, CT, US· patent location history
1995–1998Based in Plainvill, CT, US· patent location history
2006–2021Based in Burlington, CT, US· patent location history
2012–2013Patents assigned to GELORME JEFFREY D (3)· patent assignee history
2012–2013Patents assigned to HOUGHAM GARETH (2)· patent assignee history
2012–2013Patents assigned to LAURO PAUL A (2)· patent assignee history
2012–2013Patents assigned to SUNDLOF BRIAN R (2)· patent assignee history
2021Based in South Burlington, VT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 107 | 1986–2021 |
| GELORME JEFFREY Dself | 3 | 2012–2013 |
| HOUGHAM GARETH | 2 | 2012–2013 |
| LAURO PAUL A | 2 | 2012–2013 |
| SUNDLOF BRIAN R | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Plainville, CT, US | 47 | 1990–2008 |
| Burlington, CT, US | 46 | 2006–2021 |
| Binghamton, New York, US | 8 | 1986–1997 |
| Plainvill, CT, US | 2 | 1995–1998 |
| South Burlington, VT, US | 1 | 2021 |