Inventor
Philip Damberg
Inventor
Cupertino, CA, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H05KPrinted circuits21%
H01LSemiconductor devices19%
Y10TTechnical subjects covered by former us classification13%
B23KSoldering or unsoldering2%
H10DInorganic electric semiconductor devices1%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h101%
PatentTitleYear
10,756,049Package-on-package assembly with wire bond vias20209,761,558'Package-on-package assembly with wire bond vias'20179,716,075'Semiconductor chip assembly and method for making same'20179,666,450'Substrate and assembly thereof with dielectric removal for increased post height'20179,337,165'Method for manufacturing a fan-out WLP with package'20169,318,460'Substrate and assembly thereof with dielectric removal for increased post height'20169,252,122'Package-on-package assembly with wire bond vias'20169,137,903'Semiconductor chip assembly and method for making same'20159,136,197'Impedence controlled packages with metal sheet or 2-layer RDL'20159,105,483'Package-on-package assembly with wire bond vias'20159,041,227'Package-on-package assembly with wire bond vias'20158,981,579'Impedance controlled packages with metal sheet or 2-layer rdl'20158,957,520'Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts'20158,951,845'Methods of fabricating a flip chip package for dram with two underfill materials'20158,940,630'Method of making wire bond vias and microelectronic package having wire bond vias'20158,890,304'Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material'20148,884,432'Substrate and assembly thereof with dielectric removal for increased post height'20148,836,136'Package-on-package assembly with wire bond vias'20148,816,514'Microelectronic assembly with joined bond elements having lowered inductance'20148,786,083'Impedance controlled packages with metal sheet or 2-layer RDL'20148,785,790'High strength through-substrate vias'20148,637,992'Flip chip package for DRAM with two underfill materials'20148,531,039'Micro pin grid array with pin motion isolation'20138,525,338'Chip with sintered connections to package'20138,508,036'Ultra-thin near-hermetic package based on rainier'20138,410,618'Microelectronic assembly with joined bond elements having lowered inductance'20138,404,520'Package-on-package assembly with wire bond vias'20138,008,785'Microelectronic assembly with joined bond elements having lowered inductance'20117,732,912'Semiconductor chip packages and assemblies with chip carrier units'20107,709,968'Micro pin grid array with pin motion isolation'20107,521,785'Packaged systems with MRAM'20097,149,095'Stacked microelectronic assemblies'20067,061,122'Components, methods and assemblies for multi-chip packages'20066,885,106'Stacked microelectronic assemblies and methods of making same'20056,765,288'Microelectronic adaptors, assemblies and methods'20046,534,392'Methods of making microelectronic assemblies using bonding stage and bonding stage therefor'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2017Patents assigned to TESSERA INC (24)· patent assignee history
2003–2020Based in Cupertino, CA, US· patent location history
2013–2015Patents assigned to DAMBERG PHILIP (15)· patent assignee history
2013–2020Patents assigned to INVENSAS CORP (11)· patent assignee history
2013–2015Patents assigned to HABA BELGACEM (10)· patent assignee history
2013–2015Patents assigned to CHAU ELLIS (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TESSERA INC | 24 | 2003–2017 |
| DAMBERG PHILIPself | 15 | 2013–2015 |
| INVENSAS CORP | 11 | 2013–2020 |
| HABA BELGACEM | 10 | 2013–2015 |
| CHAU ELLIS | 5 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cupertino, California, US | 36 | 2003–2020 |