Inventor
FENG-JIA SHIU
Inventor
TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H10BElectronic memory devices10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10NElectric solid-state devices not otherwise provided for5%
H10DInorganic electric semiconductor devices3%
PatentTitleYear
12,532,561Image sensor device and manufacturing method thereof202612,456,649Semiconductor device and methods of manufacturing thereof202512,439,837Via structure and methods of forming the same202512,293,940Techniques for forming a deep trench isolation structure between photodiodes by forming a first set of trenches based on a first pattern and forming a second set of trenches based on a second pattern202512,165,867Method for reducing charging of semiconductor wafers202412,100,592Implantation mask formation202412,040,336Semiconductor imaging device having improved dark current performance202412,010,933Via structure and methods of forming the same202411,996,432Image sensor device and manufacturing method thereof202411,769,662Method for reducing charging of semiconductor wafers202311,665,897Improving surface topography by forming spacer-like components202311,658,031Implantation mask formation202311,538,837Semiconductor imaging device having improved dark current performance202211,502,044Methods of manufacturing semiconductor device and semiconductor device202211,489,115VIA structure and methods of forming the same202211,411,033Image sensor device and manufacturing method thereof202211,276,699Surface topography by forming spacer-like components2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (17)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 17 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 17 | 2022–2026 |