Inventor
Peng Cai
Inventor
Beijing, CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices20%
C23CCoating metallic material10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
G09GArrangements or circuits for control of indicating devices using static means to present variable information10%
H01FMagnets10%
H01RElectrically-conductive connections10%
H10DInorganic electric semiconductor devices10%
H10KOrganic electric solid-state devices10%
Y10TTechnical subjects covered by former us classification10%
Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to EPCOS AG (1)· patent assignee history
2017Based in Zhuhai, CN· patent location history
2021Patents assigned to BOE TECHNOLOGY GROUP CO LTD (3)· patent assignee history
2021Patents assigned to CHONGQING BOE OPTOELECTRONICS TECH CO LTD (1)· patent assignee history
2021Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BOE TECHNOLOGY GROUP CO LTD | 3 | 2021 |
| CHONGQING BOE OPTOELECTRONICS TECH CO LTD | 1 | 2021 |
| EPCOS AG | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 3 | 2021 |
| Zhuhai, CN | 1 | 2017 |