Inventor
Stephen F. Moxham
Inventor
Boise, ID, US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H05KPrinted circuits18%
Y10TTechnical subjects covered by former us classification18%
Y02PClimate change mitigation technologies in the production or processing of goods14%
PatentTitleYear
7,951,646'Solder ball landpad design to improve laminate performance'20117,335,978'Semiconductor component having stiffener, circuit decal and terminal contacts'20087,268,018'Method for fabricating semiconductor component with stiffener and circuit decal'20077,115,982'Semiconductor component having stiffener, stacked dice and circuit decals'20067,061,085'Semiconductor component and system having stiffener and circuit decal'20066,995,026'Methods for coupling a flowable conductive material to microelectronic substrates'20066,936,916'Microelectronic assemblies and electronic devices including connection structures with multiple elongated members'20056,913,952'Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages'20056,914,326'Solder ball landpad design to improve laminate performance'20056,870,276'Apparatus for supporting microelectronic substrates'20056,577,004'Solder ball landpad design to improve laminate performance'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2008Patents assigned to MICRON TECHNOLOGY INC (10)· patent assignee history
2003–2011Based in Boise, ID, US· patent location history
2011Patents assigned to ROUND ROCK RES LLC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 10 | 2003–2008 |
| ROUND ROCK RES LLC | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 11 | 2003–2011 |