Inventor
Toshiyuki Take
Inventor
Fujisawa, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
B23KSoldering or unsoldering18%
G06KGraphical data reading18%
B41MPrinting, duplicating, marking, or copying processes9%
F16DCouplings for transmitting rotation9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
H10HInorganic light-emitting semiconductor devices having potential barriers9%
PatentTitleYear
10,489,697Article and engraving method201910,489,696Article and code engraving method20197,119,424'Semiconductor device and method for manufacturing the same'20066,893,903'Semiconductor device and method for manufacturing the same'20056,252,252'Optical semiconductor device and optical semiconductor module equipped with the same'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2006Patents assigned to SANYO ELECTRIC CO (3)· patent assignee history
2001Based in Osaka, JP· patent location history
2005Based in Ora-gun, JP· patent location history
2006Based in Gunma, JP· patent location history
2019Patents assigned to HITACHI AUTOMOTIVE SYSTEMS LTD (2)· patent assignee history
2019Based in Fujisawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANYO ELECTRIC CO | 3 | 2001–2006 |
| HITACHI AUTOMOTIVE SYSTEMS LTD | 2 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fujisawa, JP | 2 | 2019 |
| Gunma, JP | 1 | 2006 |
| Ora-gun, JP | 1 | 2005 |
| Osaka, JP | 1 | 2001 |