Inventor

TING-KAI HUANG

Inventor
TW

Overview

9→
Patents
2022–2026
Patent span
Chemistry
Primary field (CPC C)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Gprimary
C09GPolishing compositions19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H01LSemiconductor devices17%
C09KMaterials for miscellaneous applications, not provided for elsewhere14%
B24BMachines, devices, or processes for grinding or polishing7%
C23FNon-mechanical removal of metallic material from surface7%
B29CShaping or joining of plastics2%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts2%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
C08JWorking-up2%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to FUJIFILM ELECTRONIC MAT USA INC (8)· patent assignee history
2022–2026Based in TW· patent location history
2022–2024Based in CN· patent location history
2024Patents assigned to SUNKO INK CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJIFILM ELECTRONIC MAT USA INC82022–2026
SUNKO INK CO LTD12024
Locations
LocationPatentsSpan
TW62022–2026
CN32022–2024