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Inventor

HIKARU ISHII

Inventor
JP

Overview

3→
Patents
2023–2026
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Mprimary
B41MPrinting, duplicating, marking, or copying processes15%
C09DCoating compositions, e.g. paints, varnishes or lacquers15%
B01DSeparation8%
B29CShaping or joining of plastics8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering8%
B41JTypewriters8%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds8%
F01NGas-flow silencers or exhaust apparatus for machines or engines in general8%
F02DControlling combustion engines8%
PatentTitleYear
12,570,859Primer, printing set, printing method, and printing apparatus202612,486,418Active energy ray curing composition, comprising a polymerizable monomer and a polyester resin202511,846,224Urea removing apparatus2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2026Based in JP· patent location history
2025–2026Patents assigned to ISHII HIKARU (2)· patent assignee history
2025–2026Patents assigned to RICOH CO LTD (2)· patent assignee history
2025Patents assigned to FUJITA YUUSUKE (1)· patent assignee history
2026Patents assigned to HASEBE DAIKI (1)· patent assignee history
2026Patents assigned to HYAKUTAKE DAIKI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ISHII HIKARUself22025–2026
RICOH CO LTD22025–2026
FUJITA YUUSUKE12025
HASEBE DAIKI12026
HYAKUTAKE DAIKI12026
Locations
LocationPatentsSpan
JP32023–2026