Inventor
Lawrence P. Lehman
Inventor
Endicott, NY, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits24%
B23KSoldering or unsoldering15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y02PClimate change mitigation technologies in the production or processing of goods12%
Y10TTechnical subjects covered by former us classification9%
B01DSeparation3%
B08BCleaning in general3%
C22CAlloys3%
C23CCoating metallic material3%
C23FNon-mechanical removal of metallic material from surface3%
PatentTitleYear
7,703,199'Method to accommodate increase in volume expansion during solder reflow'20107,086,147'Method of accommodating in volume expansion during solder reflow'20066,686,664'Structure to accommodate increase in volume expansion during solder reflow'20046,649,833'Negative volume expansion lead-free electrical connection'20036,639,661'Technique for imaging electrical contacts'20036,626,196'Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing'20036,228,246'Removal of metal skin from a copper-Invar-copper laminate'20016,190,530'Anode container, electroplating system, method and plated object'20016,179,990'Biased acid cleaning of a copper-invar-copper laminate'20015,902,495'Method and apparatus for establishing a solder bond to a solder ball grid array'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2010Patents assigned to IBM (10)· patent assignee history
1999–2010Based in Endicott, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 1999–2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 10 | 1999–2010 |