Inventor
Manuel Aldrete
Inventor
Encinitas, CA, US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H01LSemiconductor devices38%
H05KPrinted circuits9%
H03FAmplifiers3%
H04BTransmission3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,879,191Conformal shielding for solder ball array202010,511,268Segmented thermal and RF ground201910,490,472Air cavity mold201910,431,511Power amplifier with RF structure201910,418,333Waveguide along shielded side wall201910,325,859Shielded stacked substrate apparatus and method of fabricating201910,325,855Backside drill embedded die substrate201910,319,694Semiconductor assembly and method of making same20199,768,108'Conductive post protection for integrated circuit packages'20179,466,578'Substrate comprising improved via pad placement in bump area'20169,313,881'Through mold via relief gutter on molded laser package (MLP) packages'20169,269,681'Surface finish on trace for a thermal compression flip chip (TCFC)'20168,802,556'Barrier layer on bump and non-wettable coating on trace'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to QUALCOMM INC (13)· patent assignee history
2014–2016Based in San Diego, CA, US· patent location history
2017–2020Based in Encinitas, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 13 | 2014–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Encinitas, California, US | 9 | 2017–2020 |
| San Diego, California, US | 4 | 2014–2016 |