Inventor

Lewis S. Goldmann

Inventor

Bedford, NY, US

Overview

35→

Patents

1997–2012

Patent span

Electricity

Primary field (CPC H)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H05KPrinted circuits18%

Y02PClimate change mitigation technologies in the production or processing of goods14%

B23KSoldering or unsoldering11%

Y10TTechnical subjects covered by former us classification11%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

H01RElectrically-conductive connections4%

G01RMeasuring electric variables2%

G01BMeasuring length, thickness or similar linear dimensions1%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1%

PatentTitleYear

8,337,735'Solder mold plates used in packaging process and method of manufacturing solder mold plates'2012 8,132,775'Solder mold plates used in packaging process and method of manufacturing solder mold plates'2012 8,107,800'Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing'2012 7,566,649'Compressible films surrounding solder connectors'2009 7,518,235'Method and structure to provide balanced mechanical loading of devices in compressively loaded environments'2009 7,443,026'IC chip package having force-adjustable member between stiffener and printed circuit board'2008 7,332,821'Compressible films surrounding solder connectors'2008 7,095,614'Electronic module assembly'2006 6,955,543'Method and apparatus to form a reworkable seal on an electronic module'2005 6,858,111'Conductive polymer interconnection configurations'2005 6,724,203'Full wafer test configuration using memory metals'2004 6,678,949'Process for forming a multi-level thin-film electronic packaging structure'2004 6,462,271'Capping structure for electronics package undergoing compressive socket actuation'2002 6,459,160'Package with low stress hermetic seal'2002 6,458,623'Conductive adhesive interconnection with insulating polymer carrier'2002 6,342,407'Low stress hermetic seal'2002 6,333,563'Electrical interconnection package and method thereof'2001 6,333,209'One step method for curing and joining BGA solder balls'2001 6,333,104'Conductive polymer interconnection configurations'2001 6,287,126'Mechanical attachment means used as electrical connection'2001 6,281,452'Multi-level thin-film electronic packaging structure and related method'2001 6,278,184'Solder disc connection'2001 6,258,191'Method and materials for increasing the strength of crystalline ceramic'2001 6,253,986'Solder disc connection'2001 6,070,321'Solder disc connection'2000 5,990,418'Hermetic CBGA/CCGA structure with thermal paste cooling'1999 5,982,038'Cast metal seal for semiconductor substrates'1999 5,975,409'Ceramic ball grid array using in-situ solder stretch'1999 5,968,670'Enhanced ceramic ball grid array using in-situ solder stretch with spring'1999 5,964,396'Enhanced ceramic ball grid array using in-situ solder stretch with clip'1999 5,881,944'Multi-layer solder seal band for semiconductor substrates'1999 5,881,945'Multi-layer solder seal band for semiconductor substrates and process'1999 5,821,161'Cast metal seal for semiconductor substrates and process thereof'1998 5,800,184'High density electrical interconnect apparatus and method'1998 5,691,467'Method for mapping surfaces adapted for receiving electrical components'1997

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1997–2012Patents assigned to IBM (34)· patent assignee history

1997–2012Based in Bedford, NY, US· patent location history

2012Patents assigned to GOLDMANN LEWIS S (3)· patent assignee history

2012Patents assigned to BEZAMA RASCHID J (1)· patent assignee history

2012Patents assigned to ULTRATECH INC (1)· patent assignee history

2012Patents assigned to WALL DONALD R (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	34	1997–2012
GOLDMANN LEWIS Sself	3	2012
BEZAMA RASCHID J	1	2012
ULTRATECH INC	1	2012
WALL DONALD R	1	2012

Locations

Location	Patents	Span
Bedford, New York, US	35	1997–2012