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Inventor

LIN-TING LIN

Inventor
TW

Overview

3→
Patents
2023–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
H10BElectronic memory devices25%
H10NElectric solid-state devices not otherwise provided for25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
12,520,500Memory device and method for forming thereof202612,438,045Semiconductor structure formation202511,545,619Memory device structure and method for forming the same2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history
2023–2026Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32023–2026
Locations
LocationPatentsSpan
TW32023–2026