Inventor
ROGER D. ST. AMAND
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,394,699Semiconductor devices and methods of manufacturing semiconductor devices202512,009,343Stackable package and method202411,876,039Semiconductor devices and methods of manufacturing semiconductor devices202411,621,243Thin bonded interposer package202311,488,892Methods and structures for increasing the allowable die size in TMV packages202211,362,027Semiconductor devices and methods of manufacturing semiconductor devices2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to AMKOR TECH SINGAPORE HOLDING PTE LTD (6)· patent assignee history
2022–2025Based in US· patent location history
2024Patents assigned to AMKOR TECHNOL SINGAPORE HOLDING PTE LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECH SINGAPORE HOLDING PTE LTD | 6 | 2022–2025 |
| AMKOR TECHNOL SINGAPORE HOLDING PTE LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |