Inventor
Takeyuki Kawase
Inventor
Yamanashi, JP
Overview
22→
Patents
2005–2020
Patent span
General tagging of new technological developments
Primary field (CPC Y)
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits47%
Y10TTechnical subjects covered by former us classification43%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
10,701,851Method of mounting a component on a circuit substrate202010,299,420Electronic component mounting method20199,545,045'Component mounting device and product-type switching method'20179,474,194'Electronic component mounting system'20168,950,064'Component mounting device and component mounting method'20158,881,383'Component mounting device and component mounting method'20148,881,384'Component mounting device and component mounting method'20148,782,875'Component mounting apparatus and substrate conveyance method in component mounting apparatus'20148,595,920'Component mounting device in which a device type changing operation is performed in one mounting lane without stopping another mounting lane'20138,510,937'Component mounting apparatus and substrate conveyance method in component mounting apparatus'20138,464,421'Electronic component mounting device'20138,196,295'Component mounting method'20128,196,294'Component supply method'20128,136,219'Electronic component mounter and mounting method'20127,950,145'Component mounting apparatus and method for determining component holding members'20117,458,147'Method for determining whether a component holder is defective'20087,353,594'Component mounting method'20087,337,533'Device for mounting component'20087,200,922'Component mounting apparatus and method'20077,036,213'Device and method for mounting parts'20066,971,157'Component mounting apparatus'20056,862,803'Method for mounting electronic component'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (6)· patent assignee history
2005–2020Based in Yamanashi, JP· patent location history
2005–2008Based in Kofu, JP· patent location history
2008–2015Patents assigned to PANASONIC CORP (12)· patent assignee history
2008–2012Based in Tosu, JP· patent location history
2011–2012Based in Saga, JP· patent location history
2012–2017Patents assigned to KAWASE TAKEYUKI (12)· patent assignee history
2013–2015Patents assigned to KITAGAWA YOSHIYUKI (6)· patent assignee history
2013–2015Patents assigned to YAGI SHUZO (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KAWASE TAKEYUKIself | 12 | 2012–2017 |
| PANASONIC CORP | 12 | 2008–2015 |
| KITAGAWA YOSHIYUKI | 6 | 2013–2015 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 6 | 2005–2008 |
| YAGI SHUZO | 6 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yamanashi, JP | 12 | 2005–2020 |
| Kofu, JP | 4 | 2005–2008 |
| Saga, JP | 3 | 2011–2012 |
| Tosu, JP | 3 | 2008–2012 |