Inventor

Aleksandar Aleksov

Inventor

Chandler, AZ, US

Overview

2012–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 105 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%

H01LSemiconductor devices20%

H05KPrinted circuits10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

H01PWaveguides4%

Y10TTechnical subjects covered by former us classification4%

G06FElectric digital data processing4%

G02BOptical elements, systems or apparatus3%

B23KSoldering or unsoldering2%

H04BTransmission2%

PatentTitleYear

11,133,263High-density interconnects for integrated circuit packages2021 11,107,781RFIC having coaxial interconnect and molded layer2021 11,101,205Interconnection structure fabrication using grayscale lithography2021 11,095,012Methods for conductively coating millimeter waveguides2021 11,088,103First layer interconnect first on carrier approach for EMIB patch2021 11,081,768Fabricating an RF filter on a semiconductor package using selective seeding2021 11,062,947Inorganic dies with organic interconnect layers and related structures2021 11,050,155Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems2021 11,031,666Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric2021 11,024,933Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer2021 11,016,288Adaptable displays using piezoelectric actuators2021 11,011,470Microelectronic package with mold-integrated components2021 10,998,879Monolithic die with acoustic wave resonators and active circuitry2021 10,998,272Organic interposers for integrated circuit packages2021 10,992,017Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom2021 10,976,822Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems2021 10,969,574Process for creating piezo-electric mirrors in package2021 10,969,576Piezo actuators for optical beam steering applications2021 10,971,416Package power delivery using plane and shaped vias2021 10,964,178Systems, methods and apparatuses for implementing increased human perception of haptic feedback systems2021 10,959,633Wearable sensing patch technologies2021 10,951,248Radio frequency (RF) module with shared inductor2021 10,950,919System comprising first and second servers interconnected by a plurality of joined waveguide sections2021 10,937,594Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates2021 10,923,429Multi-chip package and method of providing die-to-die interconnects in same2021 10,872,872Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling2020 10,820,437Flexible packaging for a wearable electronic device2020 10,816,733Piezoelectrically actuated mirrors for optical communications2020 10,798,817Method for making a flexible wearable circuit2020 10,763,216Multi-chip package and method of providing die-to-die interconnects in same2020 10,741,534Multi-die microelectronic device with integral heat spreader2020 10,727,185Multi-chip package with high density interconnects2020 10,714,434Integrated magnetic inductors for embedded-multi-die interconnect bridge substrates2020 10,685,949Flexible electronic system with wire bonds2020 10,672,701Thin electronic package elements using laser spallation2020 10,658,566Piezoelectric driven switches integrated in organic, flexible displays2020 10,649,158Alignment of single and multi-mode optical fibers using piezoelectric actuators2020 10,651,525Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs2020 10,634,594Membrane test for mechanical testing of stretchable electronics2020 10,566,672Waveguide connector with tapered slot launcher2020 10,510,669Multi-chip package and method of providing die-to-die interconnects in same2019 10,492,267Display for stretchable computing device2019 10,477,688Stretchable electronic assembly2019 10,475,736Via architecture for increased density interface2019 10,468,357Stretchable electronics fabrication method with strain redistribution layer2019 10,453,812Polarization defined zero misalignment vias for semiconductor packaging2019 10,410,939Package power delivery using plane and shaped vias2019 10,403,564Dual-damascene zero-misalignment-via process for semiconductor packaging2019 10,381,291Lithographacally defined vias for organic package substrate scaling2019 10,368,439Assembly architecture employing organic support for compact and improved assembly throughput2019 10,353,146Flexible and stretchable optical interconnect in wearable systems2019 10,327,330Stretchable electronic assembly2019 10,327,331Stretchable computing device2019 10,314,171Package assembly with hermetic cavity2019 10,269,942Complementary tunneling FET devices and method for forming the same2019 10,263,312Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards2019 10,256,521Waveguide connector with slot launcher2019 10,249,925Dielectric waveguide bundle including a supporting feature for connecting first and second server boards2019 10,251,272Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates2019 10,215,164Fabric-based piezoelectric energy harvesting2019 10,206,277Gradient encapsulant protection of devices in stretchable electronics2019 10,204,855Bendable and stretchable electronic devices and methods2019 10,186,465Package-integrated microchannels2019 10,121,679Package substrate first-level-interconnect architecture2018 10,099,307Interconnect alloy material and methods2018 10,103,037Flexible microelectronic systems and methods of fabricating the same2018 10,080,290Stretchable embedded electronic package2018 10,039,186Stretchable and flexible electrical substrate interconnections2018 10,008,452Microelectronic structures having laminated or embedded glass routing structures for high density packaging2018 9,992,859Low loss and low cross talk transmission lines using shaped vias2018 9,967,040Patch system for in-situ therapeutic treatment2018 9,954,309Magnetic detachable electrical connections between circuits2018 9,915,978'Method of fabricating a stretchable computing device'2018 9,893,438'Electrical connectors for high density attach to stretchable boards'2018 9,875,969Multi-chip package and method of providing die-to-die interconnects in same2018 9,865,941'Electrical connectors for high density attach to stretchable boards'2018 9,832,863Method of fabricating a stretchable computing device2017 9,824,991'Organic thin film passivation of metal interconnections'2017 9,788,581'Textile that includes an electronic system'2017 9,786,769'Complementary tunneling FET devices and method for forming the same'2017 9,775,763'Adaptive exoskeleton, control system and methods using the same'2017 9,731,369'Interconnect alloy material and methods'2017 9,735,893'Patch system for in-situ therapeutic treatment'2017 9,685,421'Methods for high precision microelectronic die integration'2017 9,642,248'Microelectronic structures having laminated or embedded glass routing structures for high density packaging'2017 9,591,758'Flexible electronic system with wire bonds'2017 9,583,390'Organic thin film passivation of metal interconnections'2017 9,564,412'Shaped and oriented solder joints'2017 9,564,408'Space transformer'2017 9,548,410'Photovoltaic window'2017 9,526,285'Flexible computing fabric'2016 9,520,378'Thermal matched composite die'2016 9,323,327'System and method for providing tactile feedback'2016 9,257,276'Organic thin film passivation of metal interconnections'2016 9,258,880'Package substrate and die spacer layers having a ceramic backbone'2016 9,233,835'Shaped and oriented solder joints'2016 9,118,188'Wireless charging system'2015 9,076,882'Methods for high precision microelectronic die integration'2015 9,010,618'Magnetic attachment structure'2015 9,001,520'Microelectronic structures having laminated or embedded glass routing structures for high density packaging'2015 8,621,744'Method of manufacturing an inductor for a microelectronic device'2014 8,604,353'Package substrate and die spacer layers having a ceramic backbone'2013 8,434,668'Magnetic attachment structure'2013 8,227,904'Multi-chip package and method of providing die-to-die interconnects in same'2012 8,186,051'Method for fabricating package substrate and die spacer layers having a ceramic backbone'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2021Patents assigned to INTEL CORP (104)· patent assignee history

2012–2018Patents assigned to ALEKSOV ALEKSANDAR (10)· patent assignee history

2012–2018Patents assigned to SHARAN SUJIT (4)· patent assignee history

2012–2018Patents assigned to BRAUNISCH HENNING (2)· patent assignee history

2012–2018Patents assigned to CHIU CHIA-PIN (2)· patent assignee history

2012–2021Based in Chandler, AZ, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	104	2012–2021
ALEKSOV ALEKSANDARself	10	2012–2018
SHARAN SUJIT	4	2012–2018
BRAUNISCH HENNING	2	2012–2018
CHIU CHIA-PIN	2	2012–2018

Locations

Location	Patents	Span
Chandler, AZ, US	105	2012–2021