Inventor

Hsin-Hung Liao

Inventor

Taipei, TW

Overview

27→

Patents

2012–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 27 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices26%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%

B23KSoldering or unsoldering9%

Y02PClimate change mitigation technologies in the production or processing of goods5%

B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material3%

Y10TTechnical subjects covered by former us classification3%

B05CApparatus for applying fluent materials to surfaces, in general2%

C23CCoating metallic material2%

A61MDevices for introducing media into, or onto, the body1%

PatentTitleYear

10,867,890Mutli-chip package with encapsulated conductor via2020 10,770,331Semiconductor wafer device and manufacturing method thereof2020 10,727,074Method and system for thinning wafer thereof2020 10,679,866Interconnect structure for semiconductor package and method of fabricating the interconnect structure2020 10,510,712Methods for controlling warpage in packaging2019 10,504,870Mechanisms for forming bonding structures2019 10,438,922Method and system for mounting components in semiconductor fabrication process2019 10,276,509Integrated fan-out package2019 10,269,582Package structure, fan-out package structure and method of the same2019 10,157,881Methods for controlling warpage in packaging2018 10,115,690Method of manufacturing micro pins and isolated conductive micro pin2018 10,056,285Semiconductor wafer device and manufacturing method thereof2018 9,984,960Integrated fan-out package and method of fabricating the same2018 9,870,929'Package structure, fan-out package structure and method of the same'2018 9,870,997'Integrated fan-out package and method of fabricating the same'2018 9,812,346'Semiconductor wafer device and manufacturing method thereof'2017 9,768,142'Mechanisms for forming bonding structures'2017 9,498,851'Methods for forming apparatus for stud bump formation'2016 9,484,226'Methods for controlling warpage in packaging'2016 9,236,351'Semiconductor wafer device'2016 9,129,899'Method and system for thinning wafer thereof'2015 9,093,337'Methods for controlling warpage in packaging'2015 9,085,049'Method and system for manufacturing semiconductor device'2015 8,936,730'Methods for forming apparatus for stud bump formation'2015 8,540,136'Methods for stud bump formation and apparatus for performing the same'2013 8,460,564'Drug delivery chip and fabricating method thereof'2013 8,111,439'Optical switch and optical switch device having the same'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2013Patents assigned to LIAO HSIN-HUNG (3)· patent assignee history

2012–2013Patents assigned to UNIV NAT TAIWAN (2)· patent assignee history

2012–2013Patents assigned to YANG YAO-JOE (2)· patent assignee history

2012–2020Based in Taipei, TW· patent location history

2013–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history

2013–2017Based in Hsinchu, TW· patent location history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (20)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	20	2015–2020
TAIWAN SEMICONDUCTOR MFG	5	2013–2016
LIAO HSIN-HUNGself	3	2012–2013
UNIV NAT TAIWAN	2	2012–2013
YANG YAO-JOE	2	2012–2013

Locations

Location	Patents	Span
Taipei, TW	22	2012–2020
Hsinchu, TW	5	2013–2017