Inventor
Nikhil M. Murdeshwar
Inventor
Maple Grove, MN, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
A61Bprimary
A61BDiagnosis33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H05KPrinted circuits13%
Y10TTechnical subjects covered by former us classification12%
A61FFilters implantable into blood vessels6%
A61MDevices for introducing media into, or onto, the body4%
B23KSoldering or unsoldering4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
A61LMethods or apparatus for sterilising materials or objects in general2%
A61NElectrotherapy2%
PatentTitleYear
11,129,633Medical device interface202111,065,150Dual balloon fluid endometrial treatment of uterine tissue202111,007,078Device and method for sensing perforation of uterine tissue202110,912,612System and device for treating body tissue202110,779,878Thermal control devices for electrosurgical instruments202010,456,154Electrosurgical forceps with resilient jaws201910,368,940Medical forceps with offset teeth201910,271,895Combination electrosurgical device20199,561,046'Instrument with resilient jaws'20179,452,009'Combination electrosurgical device'20169,452,011'Combination electrosurgical device'20169,439,716'Bipolar coagulation probe and snare'20169,198,719'Electrosurgical fibroid ablation system and method'20159,144,454'Electrosurgical colpotomy device'20159,089,337'Electrosurgical system having grasper and snare with switchable electrode'20159,011,433'Bipolar colpotomy device'20158,933,416'Catheter insertion sterilization'20158,435,261'Treatment and placement device for sinusitis applications'20138,402,619'System and method for reducing environmental crematorial release of mercury from mercury-containing dental amalgam'20137,199,475'Semiconductor copper bond pad surface protection'20076,885,104'Semiconductor copper bond pad surface protection'20056,759,597'Wire bonding to dual metal covered pad surfaces'20046,534,877'Semiconductor copper bond pad surface protection'20036,519,845'Wire bonding to dual metal covered pad surfaces'20036,413,576'Semiconductor copper bond pad surface protection'20026,352,743'Semiconductor copper band pad surface protection'20026,267,290'Control of size and heat affected zone for fine pitch wire bonding'20016,255,208'Selective wafer-level testing and burn-in'20016,180,891'Control of size and heat affected zone for fine pitch wire bonding'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2004Patents assigned to IBM (5)· patent assignee history
2001–2007Based in Abington, PA, US· patent location history
2001–2004Based in Apalachin, NY, US· patent location history
2002–2005Patents assigned to KULICKE & SOFFA INVESTMENTS (4)· patent assignee history
2013–2015Patents assigned to ARCAND BENJAMIN (3)· patent assignee history
2013–2015Patents assigned to HALE JOSEPH E (3)· patent assignee history
2013–2021Based in Maple Grove, MN, US· patent location history
2015–2021Patents assigned to GYRUS ACMI INC (16)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GYRUS ACMI INC | 16 | 2015–2021 |
| IBM | 5 | 2001–2004 |
| KULICKE & SOFFA INVESTMENTS | 4 | 2002–2005 |
| ARCAND BENJAMIN | 3 | 2013–2015 |
| HALE JOSEPH E | 3 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Maple Grove, Minnesota, US | 19 | 2013–2021 |
| Abington, Pennsylvania, US | 6 | 2001–2007 |
| Apalachin, New York, US | 4 | 2001–2004 |