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Inventor

BOKHEON KIM

Inventor
US

Overview

2→
Patents
2022–2023
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C23CCoating metallic material13%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices13%
H10BElectronic memory devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
11,735,422Method of forming a photoresist underlayer and structure including same202311,482,533Apparatus and methods for plug fill deposition in 3-D NAND applications2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2023Patents assigned to ASM IP HOLDING BV (2)· patent assignee history
2022–2023Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ASM IP HOLDING BV22022–2023
Locations
LocationPatentsSpan
US22022–2023