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Inventor

Steven H. Laney

Inventor
Boise, ID, US

Overview

2→
Patents
1989–1990
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
G11CStatic stores25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
4,914,269'Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser'19904,882,700'Switched memory module'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1990Patents assigned to MICRON TECHNOLOGY INC (2)· patent assignee history
1989–1990Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC21989–1990
Locations
LocationPatentsSpan
Boise, ID, US21989–1990