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Inventor

Yoshiyuki Wada

Inventor
Fukuoka, JP

Overview

25→
Patents
1990–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 25 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits16%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
Y02PClimate change mitigation technologies in the production or processing of goods9%
Y10TTechnical subjects covered by former us classification8%
H04NPictorial communication, e.g. television6%
B23KSoldering or unsoldering5%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables5%
H01LSemiconductor devices5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein3%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%
PatentTitleYear
10,837,642Combustor nozzle, gas turbine combustor, gas turbine, cover ring, and combustor nozzle manufacturing method202010,611,591Conveyor device202010,266,360Conveyor device20199,862,560'Tension control device'20189,609,760'Electronic component mounting method'20179,516,749'Electronic component-mounted structure, IC card and COF package'20169,469,487'Conveyance device'20169,352,805'Oceanographic information collection system'20169,020,047'Image decoding device'20158,759,688'Electronic component mounting structure'20148,499,998'Component built-in circuit substrate and method of producing the same'20138,418,358'Wiring board with built-in component and method for manufacturing wiring board with built-in component'20138,188,605'Components joining method and components joining structure'20128,018,074'Components joining method and components joining structure'20117,966,721'Electronic component mounting method and electronic component mounting device'20117,728,745'Variable length code decoding apparatus and method with variation in timing of extracting bit string to be decoded depending on code word'20107,446,423'Semiconductor device and method for assembling the same'20087,228,064'Image decoding apparatus, recording medium which computer can read from, and program which computer can read'20077,071,577'Semiconductor device and resin binder for assembling semiconductor device'20066,617,675'Semiconductor device and semiconductor device assembly'20035,505,366'Method for mounting electronic devices'19965,489,750'Method of mounting an electronic part with bumps on a circuit board'19965,289,508'Clock information transmitting device and clock information receiving device'19945,278,651'Method and apparatus for synchronizing respective phases of high definition television signal components'19944,960,089'Combustion system'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1996–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (6)· patent assignee history
1996Based in Onojo, JP· patent location history
2003–2014Based in Fukuoka, JP· patent location history
2010–2014Patents assigned to PANASONIC CORP (7)· patent assignee history
2010–2017Based in Osaka, JP· patent location history
2012–2017Patents assigned to WADA YOSHIYUKI (6)· patent assignee history
2012–2017Patents assigned to SAKAI TADAHIKO (4)· patent assignee history
2016–2020Patents assigned to IHI CORP (5)· patent assignee history
2016–2020Based in Tokyo, JP· patent location history
2020Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PANASONIC CORP72010–2014
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD61996–2008
WADA YOSHIYUKIself62012–2017
IHI CORP52016–2020
SAKAI TADAHIKO42012–2017
Locations
LocationPatentsSpan
Fukuoka, JP92003–2014
Tokyo, JP52016–2020
Osaka, JP42010–2017
Onojo, JP21996
Kanagawa, JP12020