Inventor
TADASHI NOMURA
Inventor
JP
Overview
Patents· 33 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H05KPrinted circuits30%
H01LSemiconductor devices22%
H01QAntennas, i.e. radio aerials3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
H01FMagnets2%
B23KSoldering or unsoldering1%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy1%
H10DInorganic electric semiconductor devices1%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution1%
PatentTitleYear
12,484,141Electronic circuit module202512,469,797Electronic component module comprising plurality of components and substrate including insulating layer, ground layer and ground bump202512,456,642Module202512,412,794Module having a changing filler content rate in sealing resin layer202512,402,289Module with reduced parasite capacitance202512,363,821Circuit module202512,356,538Electronic component module202512,328,857Electronic component module and method of manufacturing electronic component module202512,309,913Module202512,309,932Electronic component module, sub-module, and method for manufacturing same202512,300,628Module and method for manufacturing same202512,267,964Electronic component module and method for manufacturing electronic component module202512,255,224Electronic component module202512,243,858Electronic component module, and method of manufacturing electronic component module202512,245,363Electronic component module, and method of manufacturing the same202512,237,271Module and method of manufacturing the same202512,224,249Package module comprising marking and shield films and method of manufacturing the same202512,193,148Module202512,177,982Module202412,160,947Electronic module202412,113,030Electronic component module comprising shield and sealing resin covering electronic components202412,087,701Package module comprising shield film on semiconductor device and method of manufacturing the same202411,968,815Module202411,903,120Radio frequency module202411,837,555Module and method of manufacturing the same202311,695,148Fuel cell system202311,682,597Module with built-in component and method for manufacturing the same202311,521,906Circuit module202211,342,280Module and method for manufacturing the same202211,309,259High frequency module202211,282,797Manufacturing method of high frequency module and high frequency module having groove in sealing resin layer202211,270,922Radio-frequency module202211,178,778High frequency module2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MURATA MANUFACTURING CO (32)· patent assignee history
2021–2025Based in JP· patent location history
2023Patents assigned to HONDA MOTOR CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 32 | 2021–2025 |
| HONDA MOTOR CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 33 | 2021–2025 |