Inventor

Jun Urakawa

Inventor
Omihachiman, JP

Overview

22→
Patents
2002–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits19%
Y10TTechnical subjects covered by former us classification16%
H01TSpark gaps15%
C04BLime, magnesia9%
H01BCables9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H02HEmergency protective circuit arrangements8%
C03CChemical composition of glasses, glazes or vitreous enamels5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
H01CResistors3%
PatentTitleYear
10,193,333ESD protection device20199,681,593'ESD protection device and method for manufacturing the same'20179,148,109'Monolithic ceramic electronic component'20159,077,174'ESD protection device and manufacturing method therefor'20158,975,099'ESD protection device and method for manufacturing the same'20158,779,466'ESD protection device and method for manufacturing the same'20148,693,157'Substrate including an ESD protection function'20148,455,918'ESD protection device and method for manufacturing the same'20138,432,653'ESD protection device'20138,426,889'ESD protection device and method for manufacturing the same'20138,421,582'ESD protection device and manufacturing method therefor'20138,361,918'Ceramic composition, method for producing the same, ceramic substrate and method for producing ceramic green layer'20138,238,069'ESD protection device'20127,790,271'Dielectric ceramic composition, ceramic substrate, and method for producing the same'20107,633,735'ESD protection device'20097,569,162'Electrically conductive paste and multilayer ceramic substrate'20097,439,202'Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component'20087,417,001'Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component'20087,368,408'Glass-ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component'20087,351,674'Insulating ceramic composition, insulating ceramic sintered body, and mulitlayer ceramic electronic component'20087,009,114'Wiring substrate, method of producing the same, and electronic device using the same'20066,452,264'Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2019Patents assigned to MURATA MANUFACTURING CO (22)· patent assignee history
2002–2019Based in Omihachiman, JP· patent location history
2006Based in Omibachiman, JP· patent location history
2009Based in Oumihachiman, JP· patent location history
2012–2014Patents assigned to URAKAWA JUN (7)· patent assignee history
2012–2013Patents assigned to ADACHI JUN (5)· patent assignee history
2012–2013Patents assigned to SUMI TAKAHIRO (3)· patent assignee history
2013Patents assigned to HIEHATA KUMIKO (1)· patent assignee history
2013–2015Based in Nagaokakyo, JP· patent location history
2015Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO222002–2019
URAKAWA JUNself72012–2014
ADACHI JUN52012–2013
SUMI TAKAHIRO32012–2013
HIEHATA KUMIKO12013
Locations
LocationPatentsSpan
Omihachiman, JP162002–2019
Nagaokakyo, JP32013–2015
Kyoto, JP12015
Oumihachiman, JP12009
Omibachiman, JP12006