Inventor
JUSTIN HUTTULA
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits20%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact13%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application13%
G06FElectric digital data processing13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B23PMetal-working not otherwise provided for7%
G01RMeasuring electric variables7%
H01LSemiconductor devices7%
Y02PClimate change mitigation technologies in the production or processing of goods7%
PatentTitleYear
12,439,572Thermal solution as an effective EMI shield202512,284,793Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices202512,262,508Heat pipe for improved thermal performance at cold plate interface202511,774,489Multi-member test probe structure2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to INTEL CORP (4)· patent assignee history
2023–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2023–2025 |