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Inventor

Hirohiko Nakata

Inventor
Itami, JP

Overview

68→
Patents
1991–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
C04BLime, magnesia15%
Y10TTechnical subjects covered by former us classification12%
H05BElectric heating10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
C23CCoating metallic material6%
G03GElectrography5%
H05KPrinted circuits4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
G01RMeasuring electric variables3%
PatentTitleYear
7,999,210'Heating device for manufacturing semiconductor'20117,855,569'Wafer holder for wafer prober and wafer prober equipped with the same'20107,837,798'Semiconductor processing apparatus with a heat resistant hermetically sealed substrate support'20107,806,984'Semiconductor or liquid crystal producing device'20107,618,494'Substrate holding structure and substrate processing device'20097,576,303'Wafer holder, and wafer prober provided therewith'20097,554,059'Heater unit and semiconductor manufacturing apparatus including the same'20097,495,460'Body for keeping a wafer, heater unit and wafer prober'20097,491,432'Ceramic susceptor for semiconductor manufacturing equipment'20097,425,838'Body for keeping a wafer and wafer prober using the same'20087,414,823'Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed'20087,408,131'Wafer holder and semiconductor manufacturing apparatus'20087,394,043'Ceramic susceptor'20087,361,230'Substrate processing apparatus'20087,342,204'Heater and heating device'20087,341,969'Aluminum nitride sintered body'20087,306,858'Aluminum nitride sintered body'20077,279,048'Semiconductor manufacturing apparatus'20077,268,321'Wafer holder and semiconductor manufacturing apparatus'20077,268,322'Semiconductor heating apparatus'20077,264,699'Workpiece holder for processing apparatus, and processing apparatus using the same'20077,211,153'Ceramic joined body, substrate holding structure and substrate processing apparatus'20077,177,536'Fluid heating heater'20077,145,106'Heater module for semiconductor manufacturing equipment'20067,090,394'Temperature gauge and ceramic susceptor in which it is utilized'20067,090,423'Connecting structures'20067,045,045'Workpiece holder for processing apparatus, and processing apparatus using the same'20066,963,052'Heater module for semiconductor manufacturing equipment'20056,946,625'Ceramic susceptor'20056,881,128'Ceramics base plate and method for producing the same'20056,806,443'Ceramic susceptor'20046,783,867'Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same'20046,770,379'Susceptor for semiconductor manufacturing equipment and process for producing the same'20046,716,304'Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder'20046,696,103'Aluminium nitride ceramics and method for preparing the same'20046,671,489'Thermal fixing apparatus'20036,664,515'Circuit pattern of resistance heating elements and substrate-treating apparatus incorporating the pattern'20036,653,604'Heater member for mounting heating object and substrate processing apparatus using the same'20036,569,524'High thermal conductivity composite material, and method for producing the same'20036,554,906'Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same'20036,548,787'Ceramic heater'20036,508,884'Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder, and semiconductor manufacturing apparatus'20036,500,052'Method of polishing a ceramic substrate'20026,460,482'Gas shower unit for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus'20026,458,444'Ceramic substrate and polishing method thereof'20026,428,741'Aluminum nitride sintered body and method of preparing the same'20026,423,400'Susceptor for semiconductor manufacturing equipment and process for producing the same'20026,403,510'Aluminum nitride sintered body and manufacturing method thereof'20026,392,197'Ceramic heater for toner-fixing units and method for manufacturing the heater'20026,384,378'Ceramic heater for toner-fixing units and method for manufacturing the heater'20026,365,879'Wafer holder for semiconductor manufacturing apparatus'20026,294,275'Aluminum-nitride sintered body, method for fabricating the same, and semiconductor substrate comprising the same'20016,271,163'Aluminum nitride sintered body and method of preparing the same'20016,261,703'Copper circuit junction substrate and method of producing the same'20016,174,614'Sintered aluminum nitride body and metallized substrate prepared therefrom'20016,122,170'Power module board and power module using the board'20006,084,221'Aluminum nitride heater'20006,078,027'Ceramic fixing heater containing silicon nitride'20006,049,064'Heat fixing device for fixing a toner image'20005,998,043'Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same'19995,955,148'Aluminium nitride ceramics and method for preparing the same'19995,732,318'Heater and heating/fixing unit comprising the same'19985,679,469'Metallized ceramic substrate having smooth plating layer and method for producing the same'19975,677,052'Aluminum nitride ceramics and method for preparing the same'19975,312,787'Ceramics composite material and method of producing the same'19945,190,895'Ceramics composite material'19935,023,147'Ceramics-metal jointed body'19914,999,144'Pressure self-combustion sintering method'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2011Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (68)· patent assignee history
1991Patents assigned to UNIV OSAKA (1)· patent assignee history
1991–2011Based in Itami, JP· patent location history
1991–2007Based in Hyogo, JP· patent location history
1993–1994Patents assigned to FINE CERAMICS CENTER (2)· patent assignee history
2009Patents assigned to TOKYO ELECTRON LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SUMITOMO ELECTRIC INDUSTRIES681991–2011
FINE CERAMICS CENTER21993–1994
TOKYO ELECTRON LTD12009
UNIV OSAKA11991
Locations
LocationPatentsSpan
Itami, JP571991–2011
Hyogo, JP111991–2007