Inventor

Lee M. Loewenstein

Inventor

Plano, TX, US

Overview

37→

Patents

1989–2010

Patent span

Electricity

Primary field (CPC H)

Patents· 37 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1041%

C23CCoating metallic material13%

C23FNon-mechanical removal of metallic material from surface8%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

H01JElectric discharge tubes or discharge lamps3%

H10DInorganic electric semiconductor devices3%

A01BSoil working in agriculture or forestry2%

C04BLime, magnesia2%

PatentTitleYear

7,732,225'Method for measuring contamination in liquids at PPQ levels'2010 6,592,676'Chemical solution and method for reducing the metal contamination on the surface of a semiconductor substrate'2003 6,180,491'Isolation structure and method'2001 6,114,741'Trench isolation of a CMOS structure'2000 6,110,838'Isotropic polysilicon plus nitride stripping'2000 5,741,396'Isotropic nitride stripping'1998 5,437,765'Semiconductor processing'1995 5,268,067'Wafer clamping method'1993 5,262,610'Low particulate reliability enhanced remote microwave plasma discharge device'1993 5,248,636'Processing method using both a remotely generated plasma and an in-situ plasma with UV irradiation'1993 5,138,973'Wafer processing apparatus having independently controllable energy sources'1992 5,101,764'Method and apparatus for integrating optical sensor into processor'1992 5,102,231'Semiconductor wafer temperature measurement system and method'1992 5,002,632'Method and apparatus for etching semiconductor materials'1991 4,988,644'Method for etching semiconductor materials using a remote plasma generator'1991 4,916,091'Plasma and plasma UV deposition of SiO.sub.2'1990 4,906,328'Method for wafer treating'1990 4,904,621'Remote plasma generation process using a two-stage showerhead'1990 4,886,570'Processing apparatus and method'1989 4,882,008'Dry development of photoresist'1989 4,878,994'Method for etching titanium nitride local interconnects'1989 4,875,989'Wafer processing apparatus'1989 4,872,938'Processing apparatus'1989 4,867,841'Method for etch of polysilicon film'1989 4,857,140'Method for etching silicon nitride'1989 4,855,016'Method for etching aluminum film doped with copper'1989 4,844,773'Process for etching silicon nitride film'1989 4,842,686'Wafer processing apparatus and method'1989 4,842,676'Process for etch of tungsten'1989 4,838,984'Method for etching films of mercury-cadmium-telluride and zinc sulfid'1989 4,836,905'Processing apparatus'1989 4,830,705'Method for etch of GaAs'1989 4,828,649'Method for etching an aluminum film doped with silicon'1989 4,822,450'Processing apparatus and method'1989 4,820,377'Method for cleanup processing chamber and vacuum process module'1989 4,820,378'Process for etching silicon nitride selectively to silicon oxide'1989 4,818,326'Processing apparatus'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2010Patents assigned to TEXAS INSTRUMENTS INC (36)· patent assignee history

1989–2003Based in Plano, TX, US· patent location history

1993Patents assigned to US ARMY (1)· patent assignee history

2003Patents assigned to IMEC INTER UNI MICRO ELECTR (1)· patent assignee history

2010Based in Dallas, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TEXAS INSTRUMENTS INC	36	1989–2010
IMEC INTER UNI MICRO ELECTR	1	2003
US ARMY	1	1993

Locations

Location	Patents	Span
Plano, Texas, US	36	1989–2003
Dallas, Texas, US	1	2010