Inventor
CHENG-SHIUAN WONG
Inventor
TW
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
B23KSoldering or unsoldering5%
H05KPrinted circuits2%
PatentTitleYear
12,564,054Package structure202612,564,008Method and treatment system for uniform processing of semiconductor devices202612,564,055Package structure and method of fabricating the same202612,543,612Semiconductor devices and methods of forming the same202612,538,827Semiconductor structure202612,500,219Trimming and sawing processes in the formation of wafer-form packages202512,266,559Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece202512,176,319Reflow method and system202411,942,451Semiconductor structure and method of forming the same202411,862,577Package structure and method of fabricating the same202411,791,192Workpiece holder, wafer chuck, wafer holding method202311,664,300Fan-out packages and methods of forming the same202311,610,859Reflow method and system202311,211,341Package structure and method of fabrcating the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history
2021–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 14 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 14 | 2021–2026 |