Inventor

HYOEUN KIM

Inventor
KR

Overview

42→
Patents
2021–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 42 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
G06NComputing arrangements based on specific computational models13%
G10LSpeech analysis techniques or speech synthesis6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G06FElectric digital data processing5%
G06VImage or video recognition or understanding5%
D06FLaundering, drying, ironing, pressing or folding textile articles4%
G05BControl or regulating systems in general4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
PatentTitleYear
12,489,071Semiconductor chip and semiconductor package including bonding layers having alignment marks202512,430,885Artificial intelligence apparatus and method for detecting unseen class items thereof202512,381,185Semiconductor packages202512,362,344Semiconductor package and method of manufacturing the same202512,087,696Semiconductor package202412,046,030Refrigerator202412,021,073Semiconductor package and method of manufacturing the same202411,990,452Semiconductor package202411,942,446Semiconductor package and method of manufacturing the same202411,923,342Semiconductor package202411,887,913Integrated circuit device and semiconductor package including the same202411,867,791Artificial intelligence apparatus for determining path of user and method for the same202411,869,818Chip-stacked semiconductor package and method of manufacturing same202411,776,544Artificial intelligence apparatus for recognizing speech of user and method for the same202311,735,566Semiconductor package202311,710,757Semiconductor package and method of fabricating the same202311,668,485Artificial intelligence air conditioner and method for calibrating sensor data of air conditioner202311,653,805Robot cleaner for performing cleaning using artificial intelligence and method of operating the same202311,657,800Electronic device with wakeup word determined multi-mode operation202311,626,385Semiconductor package202311,595,227Artificial intelligence device and operating method thereof202311,593,588Artificial intelligence apparatus for generating training data, artificial intelligence server, and method for the same202311,578,444Laundry treatment device and method of determining laundry course thereof202311,574,873Semiconductor package202311,569,201Semiconductor package and method of fabricating the same202311,545,417Integrated circuit device and semiconductor package including the same202311,545,512Image sensor package with underfill and image sensor module including the same202311,525,627Refrigerator202211,513,478AI apparatus and operation method thereof202211,444,060Semiconductor package202211,425,270Managing user-defined service202211,384,464Washing machine202211,379,756Laundry scheduling apparatus and method202211,367,438Artificial intelligence apparatus for recognizing speech of user and method for the same202211,328,966Chip-stacked semiconductor package and method of manufacturing same202211,298,560Light output device for caring for user using artificial intelligence and method of operating the same202211,227,596Laundry scheduling device202211,211,079Artificial intelligence device with a voice recognition202111,211,059Artificial intelligence apparatus and method for recognizing speech with multiple languages202111,164,586Artificial intelligence apparatus and method for recognizing utterance voice of user202111,158,603Semiconductor package and method of fabricating the same202111,152,416Semiconductor package including a redistribution line2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (21)· patent assignee history
2021–2025Patents assigned to LG ELECTRONICS INC (20)· patent assignee history
2021–2025Based in KR· patent location history
2022Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD212021–2025
LG ELECTRONICS INC202021–2025
HEWLETT PACKARD DEVELOPMENT CO12022
Locations
LocationPatentsSpan
KR422021–2025